LAT Electronics, DAQ Critical Design Requirements List
 |
Document List not complete, in
progress Also adding links to LATDocs is in progress |
||
|
|
|||
|
|
Go Here to find &view the documents: |
||
LAT Number |
Title |
Status |
|
Level 3 and Level 4 DAQ Specifications |
|||
| LAT-SS-00019 | Specifications, Level 3 T&DF Subsystem Specification | ||
| LAT-SS-00284 | Specifications, Level 4: Trigger | ||
| LAT-SS-00285 | Specifications, Level 4: Dataflow | ||
| LAT-SS-00399 | Specifications, Level 4: Software | ||
| LAT-SS-00136 | Specifications, Level 3 Power Supply System | ||
| LAT-SS-00183 | Specifications, Level 4 Power Supply System | ||
Introductory Documents |
|||
| LAT-SS-00287 | Conceptual Design of the Electronics, T&DF System | ||
| LAT-TD-00458 | Preliminary Design Report | ||
External Interfaces |
|||
| Spectrum 1196 EI-Y46311-000 | LAT-SC ICD (Spectrum) | ||
| GSFC-433-IRD | ICD, LAT-SC | ||
| LAT-SS-00363 | Specifications, ACD-DAQ Interface | ||
| LAT-SS-00238 | Specifications, CAL-DAQ Interface | ||
| LAT-SS-00176 | Specifications, TKR-DAQ Interface | ||
| LAT-SS-00467 | ICD, CAL-AFEE-TEM | ||
| LAT-SS-00293 | Specifications, Electrical Interface | ||
| LAT-SS-00294 | Interface Control Specifications | ||
| LAT-SS-01794 | ICD, Electronics-LAT Mechanical/Thermal | ||
Grounding & EMI |
|||
| GSFC-433-RQMT | EMI/EMC Requirement Document | ||
| LAT-TD-01552 | Test Plan, LAT EMI | ||
| LAT-TD-01808 | Test Plan, DAQ EMI | ||
| LAT-SS-01592 | ICD, LAT Grounding and Shielding | ||
| LAT-SS-00291 | Grounding and Shielding Plan | ||
Power Distribution Unit (PDU) |
|||
| LAT-DS-01696 |
Assembly, Power Distribution Unit |
||
| LAT-DS-02228 | Schematic Diagram, Power Distribution Unit Assembly | ||
| LAT-DS-02125 | Circuit Card Assembly, PDU | ||
| LAT-TD-02304 | Bill of Materials, PDU CCA | ||
| LAT-TD-02544 | Test Procedure, PDU CCA | ||
| LAT-DS-02126 | Printed Wire Board, PDU CCA | ||
| LAT-DS-02873 | PWB Fab, Loading and Assembly | * | |
| LAT-DS-02127 | Schematic Diagram, PDU CCA | ||
| LAT-TD-01884 | LAT PDU FPGA VHDL | ||
| LAT-TD-01744 | Test Procedure, Power Distribution Unit | ||
| LAT-TD-01743 | Specifications, Power Distribution Unit Electrical ICD | ||
| LAT-SS-01543 | Specifications, Power Distribution Module Programming ICD | ||
| LAT-TD-03636 | Dynamic Burn-in Procedure, PDU | * | |
| LAT-TD-03637 | EMI/EMC Procedure, PDU | * | |
| LAT-TD-03638 | Vibration Test Procedure, PDU | * | |
| LAT-TD-03639 | Thermal Vacuum Procedure, PDU | * | |
| LAT-TD-03668 | Thermal Cycling Procedure, PDU | * | |
| LAT-TD-01809 | Parts Stress/Worst Case Analysis, PDU | ||
Tower Electronics Module/Power Supply Assembly |
|||
| LAT-DS-01643 | Assembly, Tower Electronics Module/Power Supply | ||
| LAT-DS-01481 | Assembly, Tower Electronics Module | ||
| LAT-TD-01645 | Test Procedure, TEM Assembly | ||
| LAT-TD-03415 | Test Procedure, TEM LPT | * | |
| LAT-TD-03617 | Thermal Vacuum Test Procedure, TEM | * | |
| LAT-DS-01646 | Circuit Card Assembly, TEM DAQ | ||
| LAT-TD-03483 | TEM Vibration Test Procedure | ||
| LAT-TD-03484 | TEM Vibration Test Plan | ||
| LAT-TD-03485 | TEM Acoustic Test Procedure | ||
| LAT-TD-03486 | TEM Acoustic Test Plan | ||
| LAT-TD-03625 | Burn-in Procedures, TEM | * | |
| LAT-TD-03650 | EMI/EMC Procedure, TEM | * | |
| LAT-TD-03665 | Thermal Cycling Procedure, TEM | * | |
| LAT-DS-02583 | PWB Fab, Loading, and Assembly | * | |
| LAT-DS-01649 | Printed Wire Board, TEM | ||
| LAT-DS-01650 | Schematic Diagram, TEM CCA | ||
| LAT-TD-02230 | Bill of Materials, TEM CCA | ||
| LAT-SS-00288 | Specification, Tower Electronics Module - Electrical ICD | ||
| LAT-TD-00605 | Specification, Tower Electronics Module - A Primer ICD | ||
| LAT-TD-01782 | Parts Stress/Worst Case Analysis, TEM | ||
| LAT-TD-01880 | VHDL, LAT TEM GTIC FPGA | ||
| LAT-TD-01881 | VHDL, LAT TEM Common Controller FPGA | ||
| LAT-DS-01482 | Assembly, Tower Power Supply | ||
| LAT-DS-02388 | Circuit Card Assembly, Tower Power Supply | ||
| LAT-DS-02389 | Printed Wire Board, Tower Power Supply | ||
| LAT-DS-02548 | PWB Fab, Loading, and Assembly | * | |
| LAT-DS-02390 | Schematic Diagram, Tower Power Supply | ||
| LAT-TD-02391 | Bill of Materials, Tower Power Supply CCA | ||
| LAT-TD-02546 | Test Procedure, Tower Power Supply CCA | ||
| LAT-TD-01652 | Test Procedure, Tower Power Supply Assembly | ||
| LAT-SS-01281 | Specification and ICD, Tower Power Supply Assembly | ||
| LAT-TD-03628 | Dynamic Burn-in Procedure, TPS | * | |
| LAT-TD-03629 | EMI/EMC Procedure, TPS | * | |
| LAT-TD-03630 | Vibration Test Procedure, TPS | * | |
| LAT-TD-03631 | Thermal Vacuum Test Procedure, TPS | * | |
| LAT-TD-03666 | Thermal Cycling Procedure, TPS | * | |
| GTCC ASIC | |||
| LAT-TD-01550 | ICD, Glast Tracker Cable Controller (GTCC) ASIC | ||
| LAT-TD-01810 | Test Procedure, GTCC/GCCC ASIC | ||
| LAT-TD-02487 | GTCC1 ASIC T36T Wire Bonding and Packaging Requirements | * | |
| LAT-TD-01811 | Schematic Diagram GTCC ASIC | ||
| LAT-TD-01882 | VHDL, LAT TEM GTCC ASIC | ||
| LAT-TD-01812 | Layout GTCC | ||
| GCCC ASIC | |||
| LAT-TD-01549 | ICD, Glast Calorimeter Cable Controller (GCCC) ASIC | ||
| LAT-TD-01813 | Test Procedure, GCCC ASIC - not used | ||
| LAT-TD-01815 | Schematic Diagram GCCC ASIC | ||
| LAT-TD-01883 | VHDL, LAT TEM GCCC ASIC VHDL | ||
| LAT-TD-02656 | Screening and Test Plan GTCC/GCCC ASIC | ||
| LAT-TD-02486 | GCCC1 Wire Bonding and Packaging Requirements | * | |
| LAT-TD-01814 | Layout GCCC | ||
| GCRC ASIC | |||
| LAT-TD-03085 | GCRC5 Electrical Ratings, Operating and Maximum | * | |
| LAT-DS-02473 | GCRC Version 5 Bonding and Packaging Requirements | * | |
| GARC ASIC | |||
| LAT-TD-02331 | ACD GARC3 ASIC T36T Wire Bonding and Packaging Requirements | * | |
| GCFE ASIC | |||
| LAT-TD-03036 | GCFE9 Electrical Ratings, I/O Cell, Operating and Maximum | * | |
| LAT-DS-02474 | GCFE Version 9A Bonding and Packaging Requirements | * | |
| GAFE ASIC | |||
| LAT-TD-02489 | ACD GAFE7 ASIC T36T Wirebonding and Packaging Requirements | * | |
| LAT-TD-02490 | ACD GAFE6B ASIC Wirebonding and Packaging Requirements | * | |
| LAT-TD-02332 | ACD GAFE5G ASIC Wirebonding and Packaging Requirements | * | |
| LAT-TD-03195 | DAQ ASIC Screening Test Procedure | * | |
| LAT-TD-03196 | DAQ ASIC Thermal Cycling Test Procedure | * | |
| LAT-TD-03487 | DAQ ASIC Dynamic Burn-in Test Procedure | * | |
|
EGSE |
|||
| LAT-TD-00861 | EGSE Teststand Architecture Redux | ||
| LAT-TD-00862 | EGSE Teststand Update | ||
| LAT-TD-00593 | EGSE LAT COMM IO Board Response FIFO | ||
| GCCC/GTCC ASIC Testboard | |||
| LAT-TD-02247 | Schematic Diagram, GTCC & GCCC ASIC Test Board | * | |
| LAT-DS-01796 | Printed Wire Board, GTCC & GCCC ASIC Test Board | ||
| LAT-DS-02248 | Circuit Card Assembly, GTCC & GCCC Test Board | ||
| LAT-DS-02249 | BOM, GTCC & GCCC Test Board | ||
| GLTC ASIC Test Board | |||
| LAT-DS-02251 | CCA, GLTC2 ASIC Test Board | * | |
| LAT-DS-03748 | CCA, GLTC3 ASIC Test Board | * | |
| LAT-DS-02505 | PWB, GLTC2 ASIC Test Board | * | |
| LAT-DS-03747 | PWB, GLTC3 ASIC Test Board | * | |
| LAT-DS-02250 | Schematic Diagram, GLTC2 ASIC Test Board | * | |
| LAT-DS-03746 | Schematic Diagram, GLTC3 ASIC Test Board | * | |
| LAT-TD-02506 | Bill of Materials, GLTC2 ASIC Test Board | * | |
| LAT-TD-03749 | Bill of Materials, GLTC3 ASIC Test Board | * | |
| LAT-DS-03725 | PWB Fab, Loading, and Assembly, GLTC2 ASIC Test Board | * | |
| LAT-DS-03750 | PWB Fab, Loading, and Assembly, GLTC3 ASIC Test Board | * | |
| Front End Simulator | |||
| LAT-DS-02712 | Front End Simulator, TEM Load Board CCA | * | |
| LAT-SS-02709 | Front End Simulator, TEM Load Board PWB | * | |
| LAT-DS-02708 | Front End Simulator, TEM Load Board Schematic | * | |
| LAT-TD-02710 | Front End Simulator, TEM Load Board BOM | * | |
| LAT-DS-xxxxx | Front End Simulator, PWB Fab, Loading and Assembly | * | |
| LAT-TD-01824 | Specification, Front End Simulator | * | |
| LAT-TD-01825 | Programming ICD, Front End Simulator | * | |
| LAT-TD-01876 | Schematic Diagram, Front End Simulator | * | |
| LAT-TD-01877 | PWB, Front End Simulator | * | |
| LAT-DS-xxxxx | PWB Fab, Loading and Assembly, Front End Simulator | * | |
| LAT-DS-02648 | CCA, Front End Simulator | * | |
| LAT-DS-02654 | BOM, Front End Simulator | * | |
| TEM Test Stand | |||
| TEM and TPS Schematic Diagrams (See TEM and TPS above) | |||
| LAT-DS-03252 | EGSE Test Stand | * | |
| LAT-TD-02861 | EGSE Test Stand CAL AFEE Setup | * | |
| LAT-TD-03605 | EGSE Test Stand TKR MCM Setup | * | |
| LAT-TD-01652 | TPS CPT and LPT Test Procedure (Same as above in TPS and TEM) | * | |
| LAT-TD-03415 | TEM LPT Test Procedure (Same as TEM above) | * | |
| LAT-DS-03244 | Cable Assembly, 78-Pin Jumper | * | |
| LAT-DS-03245 | Cable Assembly, 50-Pin Ribbon Jumper | * | |
| LAT-DS-03246 | Cable Assembly, DC Power Supply Output | * | |
| LAT-DS-03247 | Cable Assembly, VME LCB Interconnect | * | |
| LAT-DS-02095 | Cable Assembly, VME Power Supply Control to TPS | * | |
| LAT-DS-02106 | Cable Assembly, DAQ TEM GASU Command | * | |
| LAT-DS-03253 | LCB Mezzanine Board CCA | * | |
| LAT-TD-860 | LCB Mezzanine Board PWB | * | |
| LAT-DS-03254 | Schematic Diagram, LCB Mezzanine Board | * | |
| LAT-DS-00999 | CCA, Test Stand Transition Board | * | |
| LAT-DS-03257 | PWB, Test Stand Transition Board | * | |
| LAT-DS-03256 | Schematic Diagram, Test Stand Transition Board | * | |
| TEM Tester | |||
| LAT-DS-02919 | CCA, TEM Tester | * | |
| LAT-DS-02917 | PWB, TEM Tester | * | |
| LAT-DS-02921 | PWB Fab, Loading ansd Assembly, TEM Tester | * | |
| LAT-DS-02918 | Schematic Diagram, TEM Tester | * | |
| LAT-DS-02920 | BOM, TEM Tester | * | |
| GTCC/GCCC ASIC Tester | |||
| LAT-DS-03034 | CCA, GTCC/GCCC ASIC Tester | * | |
| LAT-DS-03033 | PWB, GTCC/GCCC ASIC Tester | * | |
| LAT-DS-03036 | PWB Fab, Loading and Assembly, GTCC/GCCC ASIC Tester | * | |
| LAT-DS-03032 | Schematic Diagram, GTCC/GCCC ASIC Tester | * | |
| LAT-DS-03035 | BOM, GTCC/GCCC ASIC Tester | * | |
| LAT-DS-03209 | PWB, GTCC/GCCC ASIC Test Adapter | * | |
| LAT-DS-03214 | CCA, GTCC/GCCC ASIC Test Adapter | * | |
| LAT-DS-03215 | Schematic Diagram, GTCC/GCCC ASIC Test Adapter | * | |
| LAT-DS-03216 | BOM, GTCC/GCCC ASIC Test Adapter | * | |
| LAT-DS-03721 | PWB Fab, Loading and Assembly, GTCC/GCCC ASIC Test Adapter | * | |
| Tower Power Supply Tester | |||
| LAT-DS-02937 | CCA, TPS Tester | * | |
| LAT-DS-02938 | PWB, TPS Tester | * | |
| LAT-DS-02941 | PWB Fab, Loading ans Assembly | * | |
| LAT-DS-02939 | Schematic Diagram, TPS Tester | * | |
| LAT-DS-02940 | BOM TPS Tester | * | |
| 2.5 Volt Burn-in Board | |||
| LAT-DS-02759 | CCA, 2.5 Volt Burn-in Board | * | |
| LAT-DS-02760 | PWB, 2.5 Volt Burn-in Board | * | |
| LAT-DS-02761 | Schematic Diagram, 2.5 Volt Burn-in Board | * | |
| LAT-DS-02762 | BOM, 2.5 Volt Burn-in Board | * | |
| GASU Test Stand | |||
| LAT-TD-03546 | ACD G3 Test Stand, GASU to ACD FREE Interface Test Procedure for GLAT0785 GASU | * | |
| LAT-TD-03263 | ACD G3 Test Stand, Final Acceptance Test w GLAT07085 GASU | * | |
| LAT-DS-03611 | Cable Assembly, GASU External Power Supplies | * | |
| LAT-DS-02201 | Cable, ACD to GASU Test | * | |
| LAT-DS-03253 | CCA, LCB Mezzanine Board | * | |
| LAT-TD-860 | PWB, LCB Mezzanine Board | * | |
| LAT-DS-03254 | Schematic Diagram, LCB Mezzanine Board | * | |
| Heater Control Box Test Fixture | |||
| LAT-DS-03412 | Test Fixture Assembly, Heater Control Box | * | |
| LAT-DS-03413 | Schematic Diagram, Heater Control Box Test Fixture | * | |
| LAT-DS-03414 | BOM, Heater Control Box Test Fixture | * | |
| PDU Test Fixture | |||
| LAT-DS-03400 | Test Fixture Assembly, PDU | * | |
| LAT-DS-03401 | Schematic Diagram, PDU Test Fixture Assembly | * | |
| LAT-DS-03402 | CCA, Front Panel Switches, PDU Test Fixture | * | |
| LAT-DS-03403 | PWB, Front Panel Switches CCA | * | |
| LAT-DS-03404 | BOM, Front Panel Switches CCA | * | |
| LAT-DS-03405 | CCA, Test Load Interface, PDU Test Fixture | * | |
| LAT-DS-03407 | PWB, Test Load Interface CCA | * | |
| LAT-DS-03408 | BOM, Test Load Interface CCA | * | |
| LAT-DS-03409 | CCA, 264 Temp Sensors CCA | * | |
| LAT-DS-03410 | PWB, 264 Temp Sensor CCA | * | |
| LAT-DS-03411 | BOM, 264 Temp Sensor CCA | * | |
| Crate Test Box | |||
| LAT-DS-03559 | CCA, Crate Test Box | * | |
| LAT-DS-03560 | PWB Fab, Loading and Assembly, Crate Test Box | * | |
| LAT-DS-03561 | BOM, Crate Test Box CCA | * | |
| LAT-DS-03562 | Schematic Diagram, Crate Test Box | * | |
Event Processor Unit |
|||
| LAT-DS-02533 | Assembly, Event Processor Unit (EPU) | * | |
| LAT-TD-02470 | Specification and ICD, Event Processor Unit | * | |
| LAT-TD-02741 | Test Procedure, EPU | * | |
| LAT-DS-02539 | Schematic Diagram, SIU/EPU | * | |
| LAT-TD-03640 | Dynamic Burn-in Procedure, EPU | * | |
| LAT-TD-03641 | EMI/EMC Procedure, EPU | * | |
| LAT-TD-03643 | Vibration Test Procedure, EPU | * | |
| LAT-TD-03645 | Thermal Vacuum Procedure, EPU | * | |
| LAT-TD-03669 | Thermal Cycling Procedure, EPU | * | |
| Backplane Assembly (BP) | |||
| LAT-DS-01662 | Circuit Card Assembly, SIU/EPU Backplane | ||
| LAT-DS-01663 | Printed Wire Board, SIU/EPU Backplane | ||
| LAT-DS-02869 | PWB Fab, Loading and Assembly, Backplane | * | |
| LAT-DS-01695 | Schematic Diagram, SIU/EPU Backplane | ||
| LAT-SS-01540 | Specifications, LAT Crate Backplane ICD | ||
| LAT-TD-01667 | Test Procedure, SIU/EPU Backplane | ||
| LAT-TD-02586 | Bill of Materials, Backplane Assembly | ||
| Central Processing Unit (CPU) | |||
| LAT-DS-03525 | CCA, RAD750 Processor | * | |
| LAT-SS-01541 | LAT RAD750 Processor ICD SOW Specification (not public) | ||
| LAT-DS-01668 | RAD750 (purchased, not public) | ||
| Power Supply Board (PSB) | |||
| LAT-DS-01669 | Circuit Card Assembly, SIU/EPU PSB | ||
| LAT-DS-01670 | Printed Wire Board, SIU/EPU PSB | ||
| LAT-DS-01702 | Schematic Diagram, SIU/EPU PSB | ||
| LAT-DS-02870 | PWB Fab, Loading and Assembly | * | |
| LAT-TD-02356 | Bill of Materials, PSB CCA | ||
| LAT-SS-01538 | Specifications, LAT Crate Power Supply ICD | ||
| LAT-TD-01673 | Test Procedure, SIU/EPU PSB | ||
| LAT-TD-01817 | PSB Parts Stress/Electrical Worst Case Analysis | ||
| Storage Interface Board (SIB) for EPU | |||
| LAT-DS-02707 | Circuit Card Assembly, EPU SIB | * | |
| LAT-DS-01675 | Printed Wire Board, EPU/SIU SIB | ||
| LAT-DS-02871 | PWB Fab, Loading and Assembly | * | |
| LAT-DS-01676 | Schematic Diagram, SIU/EPU SIB | ||
| LAT-TD-02585 | Bill of Materials, SIB CCA | ||
| LAT-SS-01539 | Specifications, LAT Storage Interface Board ICD | ||
| LAT-TD-01678 | Test Procedure, EPU SIB | ||
| LAT-TD-02711 | Parts Stress/Electrical Worst Case Analysis, SIB | * | |
| LAT Communication Board (LCB) | |||
| LAT-DS-01679 | Circuit Card Assembly, EPU/SIU LCB | ||
| LAT-DS-01680 | Printed Wire Board, EPU/SIU LCB | ||
| LAT-DS-02872 | PWB Fab, Loading and Assembly | * | |
| LAT-DS-01681 | Schematic Diagram, SIU/EPU LCB | ||
| LAT-TD-02584 | Bill of Materials, LCB CCA | ||
| LAT-TD-01885 | VHDL, LAT LCB PCI FPGA | ||
| LAT-TD-02344 | VHDL, LAT LCB LAT-Interface FPGA | ||
| LAT-TD-01682 | Specification, EPU/SIU LCB | ||
| LAT-TD-01683 | Test Procedure, EPU/SIB LCB | ||
| LAT-TD-00860 | Programming ICD, LAT Communication Board (LCB) | ||
| LAT-TD-01819 | Parts Stress/Electrical Worst Case Analysis, LCB | ||
|
Spacecraft Interface Unit (SIU) |
|||
| LAT-DS-01862 | Assembly, Spacecraft Interface Unit Assembly | ||
| LAT-TD-01685 | Specification, SIU | ||
| LAT-TD-01686 | Test Procedure, SIU | ||
| LAT-DS-02539 | Schematic Diagram, SIU/EPU | ||
| LAT-TD-03646 | Dynamic Burn-in Procedure, SIU | * | |
| LAT-TD-03647 | EMI/EMC Procedure, SIU | * | |
| LAT-TD-03648 | Vibration Test Procedure, SIU | * | |
| LAT-TD-03649 | Thermal Vacuum Procedure, SIU | * | |
| LAT-TD-03670 | Thermal Cycling Procedure, SIU | * | |
| Backplane (BP) | |||
| LAT-DS-01662 | Circuit Card Assembly, SIU/EPU Backplane | ||
| LAT-DS-01663 | Printed Wire Board, SIU/EPU Backplane | ||
| LAT-DS-02869 | PWB Fab, Loading and Assembly | * | |
| LAT-DS-01695 | Schematic Diagram, SIU/EPU Backplane | ||
| LAT-SS-01540 | Specifications, LAT Crate Backplane ICD | ||
| LAT-TD-01667 | Test Procedure, SIU/EPU Backplane | ||
| LAT-TD-02586 | Bill of Materials, Backplane Assembly | ||
| Central Processing Unit (CPU) | |||
| LAT-DS-03525 | CCA, RAD750 Processor | * | |
| LAT-SS-01541 | LAT RAD750 Processor ICD SOW Specification (not public) | ||
| LAT-DS-01668 | RAD750 (purchased, not public) | ||
| Power Supply Board (PSB) | |||
| LAT-DS-01669 | Circuit Card Assembly, SIU/EPU PSB | ||
| LAT-DS-01670 | Printed Wire Board, SIU/EPU PSB | ||
| LAT-DS-02870 | PWB Fab, Loading and Assembly | * | |
| LAT-DS-01702 | Schematic Diagram, SIU/EPU PSB | ||
| LAT-TD-02356 | Bill of Materials, PSB CCA | ||
| LAT-SS-01538 | Specifications, LAT Crate Power Supply ICD | ||
| LAT-TD-01673 | Test Procedure, SIU/EPU PSB | ||
| LAT-TD-01817 | PSB Parts Stress/Electrical Worst Case Analysis | ||
| Storage Interface Board (SIB) for SIU | |||
| LAT-DS-01674 | Circuit Card Assembly, SIU SIB | ||
| LAT-DS-01675 | Printed Wire Board, EPU/SIU SIB | ||
| LAT-DS-02871 | PWB Fab, Loading and Asembly | * | |
| LAT-DS-01676 | Schematic Diagram, SIU/EPU SIB | ||
| LAT-TD-02585 | Bill of Materials, SIB CCA | ||
| LAT-SS-01539 | Specifications, LAT Storage Interface Board ICD | ||
| LAT-TD-01678 | Test Procedure, SIU SIB | ||
| LAT-TD-01818 | Parts Stress/Electrical Worst Case Analysis, SIB | ||
| LAT Communication Board (LCB) | |||
| LAT-DS-01679 | Circuit Card Assembly, EPU/SIU LCB | ||
| LAT-DS-01680 | Printed Wire Board, EPU/SIU LCB | ||
| LAT-DS-02872 | PWB Fab, Loading and Assembly | * | |
| LAT-DS-01681 | Schematic Diagram, SIU/EPU LCB | ||
| LAT-TD-02584 | Bill of Materials, LCB CCA | ||
| LAT-TD-01885 | VHDL, LAT LCB PCI FPGA | ||
| LAT-TD-02344 | VHDL, LAT LCB LAT-Interface FPGA | ||
| LAT-TD-01682 | Specification, EPU/SIU LCB | ||
| LAT-TD-01683 | Test Procedure, EPU/SIB LCB | ||
| LAT-TD-00860 | Programming ICD, LAT Communication Board (LCB) | ||
| LAT-TD-01819 | Parts Stress/Electrical Worst Case Analysis, LCB | ||
GAS Unit |
|||
| LAT-DS-01611 | GASU Box Assembly | ||
| LAT-SS-01544 | Specifications, GASU Electrical ICD | ||
| LAT-TD-01717 | Test Procedure, GASU Assembly | ||
| LAT-DS-02543 | Schematic Diagram, GASU Box Assembly | ||
| LAT-DS-01607 | GASU Connector Assy No. 1 | ||
| LAT-DS-01608 | GASU Connector Assy No. 2 | ||
| LAT-DS-01609 | GASU Connector Assy No. 3 | ||
| LAT-DS-01610 | GASU Connector Assy No. 4 | ||
| LAT-TD-03632 | Dynamic Burn-in Procedure, GASU | * | |
| LAT-TD-03633 | EMI/EMC Procedure, GASU | * | |
| LAT-TD-03634 | Vibration Test Procedure, GASU | * | |
| LAT-TD-03635 | Thermal Vacuum Procedure, GASU | * | |
| LAT-TD-03667 | Thermal Cycling Procedure, GASU | ||
| GASU DAQ | |||
| LAT-DS-01718 | Circuit Card Assembly, GASU DAQ | ||
| LAT-DS-01719 | Printed wire Board, GASU DAQ CCA | ||
| LAT-DS-01720 | Schematic Diagram, GASU DAQ CCA | ||
| LAT-TD-02547 | Test Procedure, GASU CCA | ||
| LAT-TD-02644 | Bill of Materials, GASU CCA | ||
| LATTD-01823 | PartsStress Worst Case Analysis, GASU CCA | * | |
| LAT-TD-03697 | VHDL, GASU-CRU FPGA | * | |
| LAT-TD-03698 | VHDL, GASU-AEM FPGA | * | |
| LAT-TD-03699 | VHDL, GASU-TAM FPGA | * | |
| LAT-TD-03700 | VHDL, GASU-Scheduler FPGA | * | |
| LAT-TD-03701 | VHDL, GASU-ROI FPGA | * | |
| LAT-TD-03702 | VHDL, GASU-EBMOUT FPGA | * | |
| LAT-TD-03703 | VHDL, GASU-EBMin_A FPGA | * | |
| LAT-TD-03704 | VHDL, GASU-EBMin_B FPGA | * | |
| GASU Internal Harness Assemblies | |||
| LAT-DS-03552 | Harness Assembly, GASU-ACD-2092 | * | |
| LAT-DS-03553 | Harness Assembly, GASU-SC-2093 | * | |
| LAT-DS-03554 | Harness Assembly, GASU-PDU-2103 | * | |
| LAT-DS-03555 | Harness Assembly, GASU-TEST-DEV | * | |
| LAT-DS-03556 | Harness Assembly, GASU-SIU/EPU-2104 | * | |
| LAT-DS-03557 | Harness Assembly, GASU-TEST-2863 | * | |
| LAT-DS-03558 | Harness Assembly, GASU-TEM_EVEN/ODD | * | |
| LAT-DS-03611 | Cable Assembly, GASU External Power Supplies | * | |
| LAT-DS-02309 | GASU Power Supply | ||
| LAT-DS-01723 | Circuit Card Assembly, GASU Power Supply | ||
| LAT-DS-01724 | Printed Wire Board, GASU Power Supply | ||
| LAT-DS-02881 | PWB Fab, Loading and Assembly | * | |
| LAT-DS-02413 | Schematic Diagram, GASU Power Supply CCA | ||
| LAT-TD-02645 | Bill of Materials, GASU PS CCA | ||
| LAT-TD-01726 | Specification, GASU Power Supply CCA | ||
| LAT-TD-01727 | Test Procedure, GASU Power Supply CCA | ||
| LAT-TD-02655 | Parts Stress/Electrical Worst Case Analysis, GASU Power Supply | ||
| GLTC ASIC | |||
| LAT-TD-01548 | Specification, GLTC2 ASIC | ||
| LAT-TD-03742 | Specification, GLTC3 ASIC | * | |
| LAT-TD-01820 | Test Procedure, GLTC ASIC | * | |
| LAT-TD-01821 | Schematic Diagram GLTC2 ASIC | ||
| LAT-DS-03743 | Schematic Diagram GLTC3 ASIC | * | |
| LAT-TD-01822 | Layout GLTC2 ASIC | ||
| LAT-DS-03744 | Layout GLTC3 ASIC | * | |
| LAT-TD-02147 | VHDL GLTC2 ASIC | ||
| LAT-DS-03745 | VHDL GLTC3 ASIC | * | |
| LAT-TD-02656 | Screening and Test Plan, GLTC2 ASIC | * | |
| LAT-TD-02488 | GLTC2 ASIC, T36T Wirebonding and Packaging Requirements | * | |
| LAT-TD-02549 | GLTC3ASIC, T36T Wirebonding and Packaging Requirements | * | |
| Other GASU Doc's | |||
| LAT-SS-00289 | Specifications, ACD Electronics Module Electrical ICD | ||
| LAT-TD-00639 | Specifications, ACD Electronics Module Programming ICD | ||
| LAT-SS-00286 | Global Trigger Description | ||
| LAT-TD-01545 | Specification, Global Trigger Programming ICD | ||
| LAT-TD-01546 | Specification, Event Builder Programming ICD | ||
| LAT-TD-01547 | Specification, Command-Response Unit Programming ICD | ||
Harness Assemblies, Interconnect |
|||
| LAT-TD-01745 | Specification, Cable Assembly | ||
| LAT-TD-01746 | Test Procedure, Cable Assembly | ||
| LAT-DS-02092 | Cable Assy, DAQ-ACD Internal | ||
| LAT-DS-02093 | Cable Assy, DAQ-Spacecraft 1PPS | ||
| LAT-DS-02094 | Cable Assy, DAQ-Spacecraft 1553 | ||
| LAT-DS-02095 | Cable Assy, DAQPDU Power | ||
| LAT-DS-02096 | Cable Assy, DAQ/PDU-Spacecraft Power | ||
| LAT-DS-02097 | Cable Assy, DAQ/SIU-Spacecraft Discrete | ||
| LAT-DS-02098 | Cable Assy, DAQ/SIU-Radiator Heater Control | ||
| LAT-DS-02099 | Cable Assy, DAQ/SIU-Spacecraft Power | ||
| LAT-DS-02100 | Cable Assy, DAQ/PDU-VHCP Temp Monitor | ||
| LAT-DS-02101 | Cable Assy, DAQ/PDU-Radiator Temp Monitor | ||
| LAT-DS-02102 | Cable Assy, DAQ/PDU-ACD Bea Temp Monitor | ||
| LAT-DS-02103 | Cable Assy, DAQ/PDU-GASU Command and Power | ||
| LAT-DS-02104 | Cable Assy, DAQ/SIU-GASU Communications | ||
| LAT-DS-02105 | Cable Assy, DAQ/SIU-PDU Command | ||
| LAT-DS-02106 | Cable Assy, DAQ/TEM-GASU Command | ||
| LAT-DS-02107 | Cable Assy, Grid Temp Base Plate | ||
| LAT-DS-02108 | Cable Assy, DAQ/EPU-PDU Power | ||
| LAT-DS-02109 | Cable Assembly, Heater Control | ||
| LAT-DS-02110 | Cable Assembly, ACD to RF Shield, External | ||
| LAT-DS-02111 | Cable Assy, DAQ-ACD External | ||
| LAT-DS-02812 | Cable Assembly, ACD to Temp Sensor Bracket | ||
| LAT-DS-02863 | Cable Assembly, RF Shield to GASU, DAQ/DAQ, External EPU Test | ||
| LAT-DS-02882 | Cable Assembly, DAQ-ACD, External System Clock, RF Shield to GASU | ||
| LAT-DS-03661 | VCHP Heater Temperature Monitoring | ||
| LAT-DS-03662 | Grid Makeup Heater Temperature Monitoring | ||
| LAT-DS-03663 | Y Grid Radiator Heater Interface Temperature Monitoring | ||
Software / Dataflow |
|||
| Plans | |||
| LAT-TD-00331 | LAT Flight Software Preliminary Design Report | ||
| LAT-MD-00104 | Flight Software Management Plan | ||
| LAT-TD-00786 | Flight Software Test Plan | ||
| LAT-PR-01535 | Flight Software Development Plan | ||
| Communication | |||
| LAT-TD-00606 | LAT Intermodule Communication | ||
| LAT-SS-00461 | LAT TEM-GASU to CPU Data Formats | ||
| ICD's | |||
| GSFC-433-IRD | LAT-SC Interface Control Document | ||
| LAT-SS-00363 | Specifications, ACD-DAQ Interface | ||
| LAT-SS-00238 | Specifications, CAL-DAQ Interface | ||
| LAT-SS-00176 | Specifications, TKR-DAQ Interface | ||
| Documents | |||
| LAT-TD-01806 | LAT Flight Software Primary Boot Code | ||
| LAT-SS-01597 | Configuration Data: Storage and Transmission | ||
| LAT-TD-01121 | LAT DAQ Trigger and Dataflow Resource Usuage | ||
| LAT-TD-00560 | LAT Global Trigger and ACD Hitmaps | ||
| LAT-TD-01781 | LAT Flight Software Package Descriptions and LOC Basis of Estimate | ||
| LAT-TD-00712 | LAT Auxiliary Data Survey | ||
| LAT-TD-01553 | Instrument Damage Protection against LAT Processor Hardware or Software Mal-Function | ||
| LAT-TD-01536 | LAT ICD for Start-up Procedures | ||
| LAT-MD-02066 | Trigger & Dataflow Sub-System Performance Analysis | ||
| LAT-SS-00912 | LAT Dataflow Simulation | ||
Monitoring |
|||
| LAT-TD-00890 | LAT Instrumentation Plan | ||
Heater Control Box |
|||
| LAT-SS-00715 | Heater Control System ICD | ||
| LAT-DS-02137 | Heater Control Box Assembly | ||
| LAT-DS-02540 | Schematic Diagram, Heater Control Box | * | |