Document Number:

 

Release Date:

 

LAT-PS-04631-01

Sep 27,2004

Authors:

Eduardo do Couto e Silva,

Lee Steele

 

 

GLAST LAT

 

Subsystem/Office:

 

Integration and Test

Document Title:

 

GLAST LAT Instrument Data Analysis Primer

 

 

 

 

Gamma Ray Large Area Space Telescope (GLAST)

Large Area Telescope (LAT)

Integration & Test (I&T)

Instrument Data Analysis Primer


 

Change History Log

Revision

Effective Date

Description of Changes

 

 

 

 

 

 

 

 

 

 

 

 

 


Contents

1.       Introduction. 9

1.1.     Hardware Overview. 9

1.2.     Overview of Data Taking During LAT Integration. 11

2.       Geometry and Numbering Scheme. 12

2.1.     ACD Geometry and Numbering Scheme. 12

2.2.     TKR Geometry and Numbering Scheme. 12

2.2.1.     CAL Geometry and Numbering Scheme. 15

3.       Readout Sequence. 17

3.1.     ACD Readout Sequence. 17

3.1.1.     Mapping across ACD Physical and Electronic Space. 17

3.2.     TKR Readout Sequence. 17

3.2.1.     Mapping across TKR Physical and Electronic Space. 17

3.3.     CAL Readout Sequence. 20

3.3.1.     Mapping across CAL Physical and Electronic Space. 21

4.       Global Trigger and Dead Time. 22

4.1.     Time Delays. 22

4.2.     Dead Time. 24

5.       Nominal Register Settings. 25

5.1.     ACD Nominal Register Settings. 25

5.1.1.     ACD Veto (hit) Threshold Discriminator 25

5.1.2.     ACD Zero-Suppression Threshold. 25

5.1.3.     ACD Time Delays. 25

5.1.4.     ACD Known Features. 25

5.2.     TKR Nominal Register Settings. 25

5.2.1.     TKR Hit Threshold Discriminator (DAC) 25

5.2.2.     TKR GTFE and GTRC Registers. 26

5.2.3.     TKR Time Delays. 27

5.2.4.     TKR Known Features. 27

5.3.     CAL Register Nominal Settings. 28

5.3.1.     CAL Time Delays. 29

5.3.2.     CAL Known Features. 29

6.       Calibrations. 31

6.1.     ACD Calibration. 31

6.2.     TKR Calibration. 31

6.3.     CAL Calibration. 32

7.       Event Data. 33

7.1.     Event Contributions. 33

7.1.1.     AEM.. 33

7.1.2.     TEM.. 33

7.1.3.     GEM.. 34

7.2.     Data Analysis Files. 34

7.2.1.     LDF.FITS. 35

7.2.2.     Digi.root 35

7.2.3.     Recon.root 35

7.2.4.     MC.root 35

7.2.5.     Merit.root 35

7.2.6.     SVAC.root 35

7.3.     Data Processing Steps. 35

8.       TKR Reconstruction. 37

8.1.     Clustering (TrkClusterAlg) 39

8.2.     Track Finding (TrkFindAlg) 39

8.3.     Track Fitting (TkrFitTrackAlg) 40

8.4.     Vertexing (TkrVertexAlg) 41

9.       CAL Reconstruction. 42

10.      Monte Carlo Simulations. 43

10.1.      Low Energy Photon Source. 43

10.2.      Cosmic Ray Source. 43

10.3.      Thresholds and Noise. 44

11.      Data Analysis. 45

11.1.      Identification of Minimum Ionizing Particles. 45

11.2.      CALTowerGap. 46

12.      Resources. 47

 


List of Illustrations

Figure 1: The LAT. 9

Figure 2: Principal LAT Components (Block Diagram) 10

Figure 3:  Tower Placement for Cosmic Ray Data Taking. 11

Figure 4: Grid Tower Positions for Monte Carlo Simulations. 11

Figure 5: LAT Tower Numbering and Grid Coordinate System.. 12

Figure 6: TKR Tower Numbering Scheme. (Note Difference between Digi and Recon.) 13

Figure 7: TKR Layer Physical Details (X-View) 14

Figure 8: CAL Crystal Layer Numbering and Orientation. 15

Figure 9: An Accurate Representation of a CAL Module. 15

Figure 10: Zoom of Region between Two Adjacent CAL Modules Profile. 16

Figure 11: CAL Crystal Dimensions. 16

Figure 12: The Four Sides of the TKR Tower with Cables. Note that “X” or “Y” Means Measured Coordinate. 19

Figure 13: CAL FEE Simplified Schematic Diagram.. 20

Figure 14: CAL Channel Signal Range Energy Overlap. 21

Figure 15: The Four Sides of the CAL Module with Cables. 21

Figure 16: Conceptual Trigger Delay Adjustments Diagram (GEM Inputs) 23

Figure 17: Conceptual Trigger Delay Adjustments Diagram (GEM Outputs) 24

Figure 18: TKR FEE Readout Channel Splitting. 26

Figure 19: Shaper Output Time over Threshold. 26

Figure 20: TDS Input and Output 33

Figure 21: Data Analysis Process Flow. 36

Figure 22: Four TKR Reconstruction Steps (Block Diagram) 37

Figure 23: Four Steps of TKR Reconstruction (Illustrated) 38

Figure 24: Iterative TKR Reconstruction Algorithms (Block Diagram) 38

Figure 25: Combinatoric Pattern Recognition: ComboFindTrack Tool 40

Figure 26: Simulation of VDG Gammas – Simulated Particle Source Generation. 43

Figure 27: Particle Flux vs Kinetic Energy for surface_muon Source. 44

Figure 28: TrkTrackLength Example of Easily Misinterpreted Data. 45

Figure 29: A Charged Particle’s Path is Parallel to the Z Axis and only Strikes Every Other Crystal 46


List of Tables

 

Table 1: Detector Readout Channels. 17

Table 2: TKR Mapping between Physical and Electronics Space. Note that “X” or “Y” Means Measured Coordinate. 18

Table 3: CAL FEE Signal Gain Characteristics. 20

Table 4: CAL Mapping between Physical and Electronics Space. 21

Table 5: Detector Timing Delay Registers. 22

Table 6: ACD Delay Register Nominal Settings. 25

Table 7: TKR GTFE and GTRC Registers. 27

Table 8: TKR Delay Registers Nominal Settings. 27

Table 9: TKR Electronics Known Features. 28

Table 10: CAL Registers for Gain, Triggering and Data Volume. 28

Table 11: CAL Registers Nominal Settings. 29

Table 12: CAL Delay Registers Nominal Settings. 29

Table 13: CAL Known Features. 30

Table 14: CAL and TKR Trigger Primitive Data. 33

Table 15: GEM Event Contribution. 34

Table 16: TKR Reconstruction Clustering Methods. 39

Table 17: TKR Reconstruction Combinatoric Track Finding Methods. 40

Table 18: TKR Reconstruction Vertexing Tools. 41

 


1.         Introduction

This document is intended to provide the LAT collaborators with sufficient information to perform data analysis during LAT integration. It is intended for users who are familiar with the LAT instrument, however a brief overview is provided.

Most of the information in this document is either copied from the website of Instrument Analysis Workshop presentations, or existing LAT-DOCS. A list of references is provided in Resources, section 12.

1.1.           Hardware Overview

The Large Array Telescope (LAT) is an integrated instrument consisting of 16 towers set into a 4x4 grid. Each tower consists of a Tracker (TKR), Calorimeter (CAL), and Tower Electronics Module (TEM), as shown in Figure 1. The 16 towers are surrounded by an Anti-Coincidence Detector (ACD) which is surrounded by an micro-meteorite shield.

Micro-Meteorite Shield

 

 

 

ACD Tiles

 

 

 

TRK Layers

 

 

Grid

 

CAL Modules

 

 

TEMs

 

Figure 1: The LAT

The following paragraphs provide a brief description of how the major components are used during pre-launch tests and are shown in Figure 2.

The ACD is mostly used to either identify charged particles for cosmic ray calibration runs, or to reject charged particles during Van de Graaff photon calibration runs.

The TKR’s function is to reconstruct the original direction of travel of either incoming photons (from 18 MeV photons from a Van de Graaff generator) or of charged particles (cosmic rays).

The CAL’s function is to measure the energy deposited by incoming charged particles, either from photon pair creation or cosmic rays.

The TEM assembles trigger primitives from the TKR and CAL (or simulated input) to determine whether or not there has been an event in the LAT. If so, it alerts the GLAST Electronics Module (GEM). It also communicates with the Event Builder Module. Trigger parameters are stored in the TEM.

The GEM (also referred to as the GLAST LAT Trigger - GLT) responds to a TEM’s message that an event has been detected and decides whether or not to generate a trigger. The GEM is an important component when performing Dead Time and Trigger analyses.

The Anti-Coincidence Detector Electronics Module (AEM) performs the same function for the ACD as the TEM does for the TKR and CAL detectors.

The Event Builder Module (EBM) communicates with the GEM, TEM and AEM.

The Global-trigger/ACD-module/Signal-distribution Unit (GASU) performs the highest logic level of event decision making, and comprises the AEM, GEM and EBM.

The Power Distribution Unit (PDU) supplies DC current to operate the electronics.

Figure 2: Principal LAT Components (Block Diagram)

NOTE: Real detectors (ACD, TKR, CAL) can be replaced by simulated input that mimics the behavior of the physical detectors beginning at the cables that readout the detectors. However, the Front End Electronics (FEE) are not simulated, but a pattern can be created to generate events.

1.2.           Overview of Data Taking During LAT Integration

Data taking with cosmic ray muons and low energy photons using the Van de Graaff accelerator will occur with 1, 2, 4, 6, 8, 10, 12, 14 and 16 Flight Modules (FMs) installed in the LAT grid. For mechanical reasons, the first position filled is position #8. The second position filled is #9. 24 hours of cosmic ray data taking occurs every time towers are added to the LAT. 24 hours of data taking with Van de Graaff photons occurs when integrating 1, 2 and 16 towers into the grid. Please refer to LAT-MD-00575 for detailed information on  data taking during integration. Figure 3 shows the tower positions filled in each data taking configuration. Note that shaded squares indicate a tower installed in the grid.

For each hardware configuration there will be a baseline cosmic ray data-taking run for which the hardware is configured with nominal settings (please refer to the Nominal Register Settings in section 5) for ground analysis for the integrated hardware (towers).

Figure 3:  Tower Placement for Cosmic Ray Data Taking

Monte Carlo simulations for Flight Modules will be performed for 1, 2, and 8 towers, and the fully integrated LAT grid, as shown in Figure 4.

Figure 4: Grid Tower Positions for Monte Carlo Simulations


2.         Geometry and Numbering Scheme

The global instrument coordinate system for the LAT is consistent with the coordinate system for the observatory. It is a right-handed coordinate system with the Y-axis parallel to the solar panel axis, the Z axis normal to the planes of the TKR, CAL, and Grid (i.e., parallel to the “bore sight”), and the X axis is mutually perpendicular to Y and Z. The positive Z-axis points from the CAL to the TKR. Particles entering the instrument at normal incidence are thus oriented along the -Z direction (please see Figure 5).

The point X=Y=0 is at the center of the Grid. The Z=0 plane is at the top face of the Grid, between the TKR and CAL units on the TKR side of the Grid. The TKR silicon layer closest to Z = 0 is at Z = +33 mm; the crystal layer closest to Z = 0 is at Z = -46 mm.

Figure 5: LAT Tower Numbering and Grid Coordinate System

2.1.           ACD Geometry and Numbering Scheme

The active elements of the ACD consist of 89 tiles and 9 ribbons. (A figure will be added later.)

2.2.           TKR Geometry and Numbering Scheme

The tracker is made up of 19 trays comprising 36 layers as shown in Figure 6. It is important to note that layers are numbered and labeled differently depending on whether the variable was calculated in a digi or recon file. Please refer to Event Data  in section 7.

NOTE: In this document a “layer” is one side of a tray, only. This is not always the convention used for TKR layers, but it is the convention used throughout this document.

The TKR trays are numbered in increasing order with increasing Z. Each tray has two active layers, except the top half of the top tray (+Z) and bottom half of the bottom tray.

A tray measures in either the X or Y direction, i.e., has an X or Y view. To get X and Y information, layers from two adjacent trays are electronically combined. X and Y layers are about 2 mm apart. This arrangement leaves the top-most and bottom-most layers without a partner and without silicon detectors.

A tray with detector strips physically parallel to the Y axis is an X tray: it measures the X coordinate (has an X view) and is called an X tray. Please see Figure 7. Most layers have an embedded tungsten foil for g conversion: The top 12 X and Y pairs have a thin foil (3% of X0), the next four have a thick foil (18% of X0), and the bottom two X and Y pairs have no tungsten.

The active regions of the TKR layers are comprised of Silicon Strip Detectors (SSDs). Each SSD has 384 strips. Four SSDs are end-joined to make a ladder with the four SSDs in a given ladder electronically joined to make 384 long strips. With four ladders per layer, there are a total of 1536 strips per layer. Each layer is about 360 mm2.

Figure 6: TKR Tower Numbering Scheme. (Note Difference between Digi and Recon.)

Figure 7: TKR Layer Physical Details (X-View) 

2.2.1.        CAL Geometry and Numbering Scheme

Each CAL module is made up of 96 crystals in an 8 x 12 orthogonal layering of 12 crystals per layer and 8 layers. A CAL crystal makes its coordinate measurement along its principal axis: an X crystal has its principal axis along the X direction, as shown in Figure 8.

Each crystal has two PIN diodes at each end for reading out the signal. Each PIN diode (at either end) reads out for either the low or high energy measurement. The low energy PIN has an area four times greater than the high energy PIN.

The CAL layers are numbered from 0 – 7 in increasing order with decreasing Z. The CAL layer closest to the TKR is layer 0. CAL layer 0 has X crystals; CAL layer 7 has Y crystals. The CAL logs are read from each end, and the log ends are either plus or minus: the end with the larger value of the coordinate is the “plus” end and the end with the smaller value of the coordinate is the “minus.”

Figure 8: CAL Crystal Layer Numbering and Orientation

Figure 10 shows an accurate representation of a CAL module.

Figure 9: An Accurate Representation of a CAL Module

Figure 10 shows a close-up view of the displacement of CAL crystal ends of two adjacent CAL modules. It is important to note that crystal ends that face each other are at a different spacing than the closest crystals in adjacent modules that are parallel to each other.

 

Figure 10: Zoom of Region between Two Adjacent CAL Modules Profile

The CAL crystal profile is shown in Figure 11 along with the dimensions of a CAL crystal, including its carbon fiber enclosure.

Figure 11: CAL Crystal Dimensions


3.         Readout Sequence

Table 1 lists the number of readout channels (active elements) for the ACD, TKR and CAL in a 1, 2, 4, 8, and the full LAT configuration. Note that the ACD front-end PCBs actually have 216 channels, but because each tile is read by 2 PMTs that are assembled with a logical OR, the number of tiles that can be read out is actually 108. With a total number of  97 tiles and ribbons, some channels are not used.

Table 1: Detector Readout Channels

 

ACD

TKR

CAL

 

Tiles/Channels

Ribbons/Channels

Layers/ Channels

Crystals/ Channels

1 Tower

 

 

36 / 55,296

96 / 384

2 Tower

 

 

72 / 110,592

192 / 768

4 Tower

 

 

144 / 221,184

384 / 1536

8 Tower

 

 

288 / 442,368

768 / 3072

LAT

89/178

8/16

576 / 884,736

1536 / 6144

3.1.           ACD Readout Sequence

To be written.

3.1.1.        Mapping across ACD Physical and Electronic Space

To be written.

3.2.           TKR Readout Sequence

Data from each silicon layer is read out by 24 GTFE ASICs located in a Multi-Chip-Module (MCM), controlled by 2 GLAST Tracker Readout Controllers (GTRC). There are 2 (GTRC 0 and GTRC 1) per layer or 4 per tray (please see Figure 18). The two GTRCs are situated at the edge of the layer. GTRC 0 (RC0) is defined as being closest to where strip 0 is located. RC1 is defined as where strip 1535 is located. The default mode is to read from both ends. The readouts of a TKR is carried through eight cables (please see Figure 12).

If any shaper-out signal of a channel in a GTFE chip is over threshold, a trigger request (TREQ) signal is issued and transferred to the TEM, which then checks the trigger status. If a trigger condition (3-in-a-row) is satisfied, the TEM sends the trigger request acknowledge (TACK) signal to all layers to latch hit strip data into GTFE event buffers. Each GTFE has 4 event buffers. Note that it is not the TREQ but the TACK signal that starts the Time over Threshold (ToT) counter in the GTRC.

The TEM sends the READ-OUT command and transfers event data from GTFE event buffers to GTRC event buffers. A GTRC event buffer is limited to 64 hit-strips. The GTRC has 2 buffers. The TEM sends the TOKEN signal and transfers event data from the GTRC event buffers to the TEM one layer at a time. The GTRC waits to send data until the process of the READ-OUT command finishes, and the ToT counter terminates. The ToT counter saturates at 1000 clock cycles (= 50 μs).  In a case where the ToT counter overflows, the GTRC will start to send data at the overflow point (1000 clock cycles).

3.2.1.        Mapping across TKR Physical and Electronic Space

The TKR mapping scheme is shown in Table 2. This table maps the TKR physical information in LDF, digi and recon files. Figure 12 shows the four faces of the TKR. A typical user does not need to know the information in electronics space. This table is intended to serve as a reference for hardware-oriented people. Before using the Electronics Space information, always verify that it is the latest information in the TEM manual.

Table 2: TKR Mapping between Physical and Electronics Space. Note that “X” or “Y” Means Measured Coordinate.

Physical Space (data analysis)

Electronics Space (command the instrument)

Tray  #

Digi file

Layer

Recon file

LDF file

Plane

View

GTCC (Cable)

GTRC

18/B

35

0

Y

4,5

8

17/T

34

0

X

6,7

8

17/B

33

1

X

2,3

8

16/T

32

1

Y

0,1

8

16/B

31

2

Y

4,5

7

15/T

30

2

X

6,7

7

15/B

29

3

X

2,3

7

14/T

28

3

Y

0,1

7

14/B

27

4

Y

4,5

6

13/T

26

4

X

6,7

6

13/B

25

5

X

2,3

6

12/T

24

5

Y

0,1

6

12/B

23

6

Y

4,5

5

11/T

22

6

X

6,7

5

11/B

21

7

X

2,3

5

10/T

20

7

Y

0,1

5

10/B

19

8

Y

4,5

4

9/T

18

8

X

6,7

4

9/B

17

9

X

2,3

4

8/T

16

9

Y

0,1

4

8/B

15

10

Y

4,5

3

7/T

14

10

X

6,7

3

7/B

13

11

X

2,3

3

6/T

12

11

Y

0,1

3

6/B

11

12

Y

4,5

2

5/T

10

12

X

6,7

2

5/B

9

13

X

2,3

2

4/T

8

13

Y

0,1

2

4/B

7

14

Y

4,5

1

3/T

6

14

X

6,7

1

3/B

5

15

X

2,3

1

2/T

4

15

Y

0,1

1

2/B

3

16

Y

4,5

0

1/T

2

16

X

6,7

0

1/B

1

17

X

2,3

0

0/T

0

17

Y

0,1

0

Figure 12: The Four Sides of the TKR Tower with Cables. Note that “X” or “Y” Means Measured Coordinate.

3.3.           CAL Readout Sequence

The CAL crystals are normally read from both ends through a total of four cables – each crystal is read out by two cables. Each crystal end has two PIN diodes, one large and one small, for low and high energy, respectively. Each crystal end (left and right ) has its own FEE pre-amplifier electronics assembly. Both low and high energy signals go through a pre amp and shaper then a Track and Hold gain multiplier and into an analog multiplexer and finally to the Analog to Digital Converter (ADC). A simplified schematic diagram is shown in Figure 13. The calibration charge injection signal is fed to the front end of these pre amps.

Figure 13: CAL FEE Simplified Schematic Diagram

Table 3 shows the gain stages.

Table 3: CAL FEE Signal Gain Characteristics

Channel

Diode Discrimination

Pre Amp Gain

Track and Hold Gain

Signal Out of Track and Hold

Relative Gain

Low Energy

X 6

X 64

X 1

LEX1

64

X  8

LEX8

512

High Energy

X 1

X 1

X 1

HEX1

8

X 8

HEX8

1

Figure 14 shows how the energy ranges overlap. During cosmic ray data taking on the ground most of the events fall within the low range diodes.

Figure 14: CAL Channel Signal Range Energy Overlap

3.3.1.        Mapping across CAL Physical and Electronic Space

Table 4 maps the locations of layers and crystal ends between the electronics space and the physical space. A typical user does not need to know the information in electronics space. This table is intended to serve as a reference for hardware-oriented people. Before using the Electronics Space information, always verify that it is the latest information in the TEM manual.

Table 4: CAL Mapping between Physical and Electronics Space

Physical Space (Used for data analysis)

Electronics Space

(Used to command the instrument)

 

 

Layer # / Layer Type

Digi File Layer

Recon File Layer

LDF File

 

 

 

 

 

GCCC (Cable)

GCRC

 

0 / X

0

0

0,2

0

 

 

1 / Y

1

1

1,3

0

 

 

2 / X

2

2

0,2

1

 

 

3 / Y

3

3

1,3

1

 

 

4 / X

4

4

0,2

2

 

 

5 / Y

5

5

1,3

2

 

 

6 / X

6

6

0,2

3

 

 

7 / Y

7

7

1,3

3

 

The CAL readout cables and the associated GCCC are shown in Figure 15.

Figure 15: The Four Sides of the CAL Module with Cables


4.         Global Trigger and Dead Time

The Trigger inputs from the ACD, CAL and TKR are processed by the GEM. The GEM decides whether to read out an event or not based on all inputs received. Therefore trigger primitives can be issued but may lead to no data latched if the GEM decides that all necessary conditions have not been met.

Any of the three detectors (ACD, CAL and TKR) can issue a trigger request (TREQ) but data is only latched from the detector buffers if the GEM logic is satisfied that a trigger acknowledge (TACK) is warranted.

The ACD signals are usually used as a veto for charged particles. However, the CNO signal can be used to trigger on heavy nuclei (mostly used for calibrations). During ground testing we can only test the CNO signal through charge injection. Another useful concept one has to keep in mind is that Regions Of Interest (ROI) can be defined using the ACD tiles. So a number of tiles can be logically grouped for trigger/veto purposes.

The TKR trigger logic requires at least one hit above a predetermined threshold in three consecutive XY layers (six layers).

The CAL trigger logic requires at least one hit above a predetermined threshold in any of the crystals.  One can have a low energy trigger and a high energy trigger. For ground testing with cosmic rays the nominal CAL low-energy trigger is already too high and one must lower the discriminator thresholds or use the TKR trigger, instead.

During ground testing there will be a pattern generator (software) that will produce several trigger rates from a few Hz to tens of kHz. These solicited triggers will be overlaid with the nominal trigger conditions (e.g. TKR trigger) to study the behavior of the trigger and data flow system.

To trigger on a set of trigger inputs coming from different detectors, they must all fall within the same time coincidence window, but the system must not be busy (already reading an event). Note that during ground testing in order to cope with rates greater then 1.5 kHz one may have to prescale (discard) events.

For the TKR, the hit threshold is also the trigger threshold. The threshold is that six consecutive layers must be fired. Nominal trigger rate on the ground (no ACD) is roughly 25 Hz (TBR) for each TKR tower for cosmic ray analysis.

4.1.           Time Delays

All three subsystems have preamps that put out shaped pulses that peak at different times after the entrance time (t0) for the particle into the LAT.

Any one of the three detectors can cause the GEM to issue a TACK which latches the buffered data of all three detectors regardless of whether or not they issued a trigger request. The purpose of the time delays is to ensure that the trigger window is open at the correct time to receive data from all the detectors at the peak of the input pulses for a given detector. Table 5 shows the different delays for the ACD, CAL and TKR. The table is for the entire ACD but just one of the 16 tower modules.

Table 5: Detector Timing Delay Registers

Detector

Delays on GEM Input

Delays on GEM Output

ACD

12 TREQ Delays

12 TACK Delays

CAL High

4 TREQ Cable Delays

1 TREQ Delay (OR of 4 inputs)

1 TACK Delay (applied to all 4 cables)

4 TACK Cable Delays

CAL Low

1 TREQ Delay (OR of 4 inputs)

TKR

8 TREQ Cable Delays

1 TREQ Delay (OR of 8 inputs)

1 TACK Delay (applied to all 8 cables)

8 TACK Cable Delays

Figure 16 shows the various time delay registers that are available at the input to the GEM. CAL low and CAL high come in on the same four cables, each with a cable delay. CAL high and CAL low are then split into two lines with each line having a TREQ delay as input to the GEM. The TKR signals come in on eight cables, each with a delay register. The eight signals are OR’d into one line which has a delay register before input into the GEM. The ACD signals come in through 12 lines, each with a delay in the GEM input.

Figure 16: Conceptual Trigger Delay Adjustments Diagram (GEM Inputs)

The GASU output (please see Figure 17) has an adjustable Trigger Window Width register that feeds all three detectors with a single signal line. For the CAL it passes through a TACK delay register before being split into four lines, each with a CAL TACK cable delay. Likewise, the GASU output signal passes through a TKR TACK delay before being split into eight lines, each with a TKR TACK cable delay. For the ACD the GASU output signal splits into 12 lines, each with an ACD TACK delay register.

 

Figure 17: Conceptual Trigger Delay Adjustments Diagram (GEM Outputs)

4.2.           Dead Time

To be written.


5.             Nominal Register Settings

There are hundreds of registers in the LAT. Here we discuss only a few registers that one need be aware for data analysis.

5.1.           ACD Nominal Register Settings

To be written.

5.1.1.        ACD Veto (hit) Threshold Discriminator

To be written.

5.1.2.        ACD Zero-Suppression Threshold

To be written.

5.1.3.        ACD Time Delays

The ACD has 12 ACD TREQ delay registers feeding into the GEM. There are also 12 ACD TACK delay registers applied to the output of the GEM for ACD hold. Table 6 lists the nominal settings for the ACD delays. Until test are performed assume that all 12 delays for the input or output are equal.

Table 6: ACD Delay Register Nominal Settings

Register

Setting

12 TREQ Delays

 

12 TACK Delays

 

5.1.4.        ACD Known Features

To be written.

5.2.           TKR Nominal Register Settings

Nominal settings for the registers of interest are described here.  The registers of interest are the GTFE registers MODE, DAC and MASK, and the GTRC registers for GTFE_CNT, SIZE, and TOT_EN and time delays.

5.2.1.        TKR Hit Threshold Discriminator (DAC)

The GTFE threshold setting defines an energy value above which the preamplifier in each channel integrates the charge collected until the charge signal re-crosses the threshold. The time the signal remains above the threshold is the ToT. Please see Figure 19.

Each strip hit in a silicon layer contributes with a ToT value. A logical OR of all strips in the layer is used to determine the value of the ToT per layer. ToT can be used to crudely determining the amount of energy deposited on the TKR because its value is dominated by the strip with the highest energy deposited. Channel-to-channel variations exist and this is discussed further in the Calibrations Section, 6.2.

Each layer generates two ToT values because it can be read out by 2 GTRC chips (please see Figure 18). The default configuration is to read 12 GTFEs with each GTRC: 12 GTFE chips read out by GTRC0 and 12 GTFE chips read out by GTRC1. If a GTFE fails it can be by-passed and the split is modified from the usual 12/12. Every data analysis run includes a report that states what the GTRC split is, which is important for Timing and Trigger studies.

Figure 18: TKR FEE Readout Channel Splitting

The hit threshold can be set individually for each GTFE with a default value of 0.25 of that of a Minimum Ionizing Particle (MIP). The goal for the data taking with cosmic rays and VDG accelerator is to have a uniform set of thresholds across all readout chips. These are determined by measuring both the trigger capture efficiency and the noise rate as a function of the discriminator DAC settings.  

Figure 19: Shaper Output Time over Threshold

 

5.2.2.        TKR GTFE and GTRC Registers

The GTFE and GTRC registers of interest are shown in Table 7.

Table 7: TKR GTFE and GTRC Registers

 

Register

Type

Selects

GTFE

(Please refer to LAT-SS-00169 for further details.)

Mode

2-bit

Left or Right mode (Is the GTFE read out by the left or right GTRC)

Deaf mode ON / OFF (Is the GTFE deaf to the GTFE beside it?)

DAC

7-bit +

7-bit

THR_DAC: (0-2 MIPS) Sets the threshold level of the comparator. Range: about 0.05 -10 fC

CAL_DAC: (0-8 MIPS) Sets pulse height of calibration strobe signal. Range: about 0.072-43 fC

Mask

64-bit

Channel mask

Trigger mask

Calibration mask

GTRC

(Please refer to LAT-SS-00170 for further details.)

GTRC_CNT

 

Sets the number of GTFEs to read by defining the LEFT/RIGHT split point. Range: 0-24. The default is 12 LEFT and 12 RIGHT. Please see Figure 18.

Size

 

Sets the maximum number of hits to get from the GTFEs. Range: 0-64. The default is 64.

NOTE: Max hits/layer: 128 can be read using both LEFT and RIGHT sides.

TOT_EN

1-bit

ENABLE TOT (1) or DISABLE TOT (0). The default is 1.

5.2.3.        TKR Time Delays

Each TKR has a total of nine TREQ delays.  Each TKR has a total of nine TACK delays. Table 8 lists the TKR delay register nominal settings. Until test are performed assume that the cable delays for an input or output are equal.

Table 8: TKR Delay Registers Nominal Settings

Register

Setting

TREQ (8 – 1 per cable)

 

OR’d TREQ (1)

 

TACK (1 – applied to all 8 cables)

 

TACK (8 – 1 per cable)

 

5.2.4.        TKR Known Features

Some known features for the TKR electronics are shown in Table 9.

 

 

 

 

 

Table 9: TKR Electronics Known Features

Feature

Description

Limit of TOT Counter

The TOT counter saturates at 1000 count, corresponding to 50 μs. (c.f. 1 MIP ~ 10 μs.)

Limitation of Calibration-Strobe Signal in GTFE

The calibration strobe signal of GTFE used in charge-injection tests is a signal with a duration of 512 clock cycles = 25.6 μs.  Thus, we cannot simulate TRIG signal longer than 25.6 μs with the internal calibration system.

TACK Too Late in a Small Signal

Small signal events with the pulse height very close to threshold will be missed at the TACK time, which causes the event with a trigger but no hit. The probability of such events was 10-5 in EM1 tower.

2 TACKs in One TREQ Signal

If multiple TACK signals are sent within one long trigger signal, TOT in the second readout event shows an illegal number (2044).

5.3.           CAL Register Nominal Settings

CAL Nominal register settings are divided into the three categories of Gain, Triggering and Data Volume as shown in Table 10.

Table 10: CAL Registers for Gain, Triggering and Data Volume

 

Register

Range

Comments

Gain

LE

8 programmable settings for a x3 gain-range.

One setting per CAL face (= 16 towers x 4 faces) 

HE

9 programmable settings, x3 in gain plus test gain for muons.

One setting per CAL face (= 16 towers x 4 faces) 

Time to Peak

Adjustable so that track-and-hold occurs at the peak of the shaped signal.

One setting per tower with different settings for muons and charge injection.

Triggering

FLE

Threshold  adjustable for every CAL crystal end (1536/crystal x 2 faces) with 64 fine and 64 coarse programmable DAC settings that cover about 200 MeV

Fast Low Energy (FLE) and Fast High Energy (FHE) have a timing constant of .5 μs, important for timing and analysis.

 

(For reference, the Slow Low Energy shaper has a timing constant of about 3.5 μs.)

FHE

Threshold is adjustable for every CAL crystal end (1536/LAT x 2 faces) with 64 fine and 64 coarse programmable DAC settings that cover about 25 GeV.

Data Volume

Range Read

Range Readout can be either commanded or run in Auto-range. The range modes are one range or four ranges.

In Auto-range, the appropriate energy channel is selected and read out.

Table 11 shows the nominal register settings for the different modes of data taking, of which there are two: flight and ground.

Flight mode tests flight operations with a best guess at on orbit configuration. Ground mode tests high gain in the HE channels to see muons and VDG photons, and with thresholds low enough for CAL to trigger on muons and VDG photons.

 

 

 

Table 11: CAL Registers Nominal Settings

Mode

Test

Settings

Flight

Ground test of flight operations

TKR: trigger enabled

FLE: ~ 100 MeV but disabled

FHE: ~ 1 GeV enabled

LE rails:  ~ 1.6 GeV

HE rails:  ~ 100 GeV

Auto Range: one range readout

Zero-suppression: enabled

LAC threshold ~ 2 MeV or below

Ground

Muons visible in HE ranges. Muon runs to test stability.

Flight Trigger

TKR:  trigger enabled

FLE: ~ 100 MeV but disabled

FHE: ~ 1 GeV, enabled

Muon Gain:

LE rails: ~1.6 GeV

HE rails: ~4 GeV

Intermediate Data Volume:

Auto-range, four-range readout

Zero-suppression: enabled

LAC threshold ~ 2 MeV or below

Ground

Muons visible in HE ranges. Ground test of CAL self-trigger.

CAL Trigger

TKR trigger: disabled

FLE: ~2 MeV and FHE ~ 1 GeV (trigger on FLE)

FLE: ~ 100 MeV and FLE < 10 MeV (trigger on FHE)

Auto-range, four-range readout

Zero-suppression: enabled

LAC threshold ~ 2 MeV or below

5.3.1.        CAL Time Delays

Each CAL has a total of six TREQ delays. Each CAL has a total of five TACK delays. Table 12 lists the delay register nominal settings. Until test are performed assume that the cable delays for an input or output are equal.

Table 12: CAL Delay Registers Nominal Settings

Register

Setting

TREQ (4 – 1 per cable)

 

CAL Low TREQ (1)

 

CAL High TREQ (1)

 

TACK (1 – applied to all 4 cables)

 

TACK (4 – 1 per cable)

 

5.3.2.        CAL Known Features

Table 13 below lists some of the known features of the CAL electronics.

Table 13: CAL Known Features

Feature

Description

Readout time can be long

 

In a case with 4-range, unsuppressed CAL readout of  ~ 600 μs:

Because of the TEM readout buffer logic, one of these events does indeed paralyze the entire system for ~ 600 us. FIFO has space for less than 2 of these events, and readout is paralyzed if space for less than 1 remains.

Solicited triggers with zero suppression enabled

Readout time is a function of the CAL data volume. Either set the LAC threshold low so that some pedestals sneak through, or inject charge in some specific channels, or CAL data will be null. Tests with high-rate, Poisson solicited triggers must be carefully posed.

CAL can retrigger

If CAL self-trigger is enabled with a low threshold and zero suppression is enabled, CAL may double-trigger because the trigger gets re-enabled before it settles.

Retrigger does not occur with zero supp disabled (i.e. large CAL data volume) because TEM readout is slow enough that FLE has had time to settle.

CAL trigger biases energy

 

If the FLE fires (whether or not it’s enabled) about 2 MeV gets added to LEX8 and LEX1 signals. Don’t calibrate gain scale with FLE set low for CAL self-trigger on muons or VDG photons. There is a similar effect for FHE firing which adds ~ 20 MeV.


6.         Calibrations

Instrument calibrations consist of:          

·         Creation of response maps for all detectors;

·         Determination of nominal instrumental settings for astrophysical science observations, and;

·         Determination of energy scales.

The program is divided into electronic calibrations (using charge injection) and calibrations using cosmic rays (selected muons). These will have calibration trends characterized during the LAT integration. For details, please refer to LAT-MD-00575.

The user should be aware that data taking will occur with zero suppression ON and OFF at several stages of integration. 

ACD, TKR and CAL electronic calibrations are performed using charge injection and with EGSE scripts and/or Flight Software. Whenever appropriate EGSE output calibration files will be used as input to the reconstruction code. Be aware that the trigger behavior may be different when triggering with cosmic rays and with charge injection. Data from charge injection will be available in digi format but this primer is not intended to guide general users to analyze those data.

Calibrations will be performed after particle data is taken using offline analysis of the L1 data converted into digitized data analysis files. Calibration data is then used as input to generate reconstructed data analysis files.

6.1.           ACD Calibration

The ACD electronic calibration suite establishes the calibration tables for the following features of each GAFE. These calibration tables give the correspondence between relevant DAC settings and output ADC bin or energy, as appropriate.

Units of calibration tables can be converted to MeV in all gain settings. The ACD calibration will determine:

·         Pedestals for all energy ranges in all gain settings. An estimate of the electronic noise can be derived from the pedestal width;

·         FEE transfer function for all energy ranges, i.e., the integral non-linearity of the analog and digital chain for each energy range. The electronic gain of each energy range is given by the linear term of the correspondence between injected charge and output ADC bin;

·         Calibration of the veto (hit) threshold discriminator DAC; and

·         Calibration of the zero-suppression threshold  DAC.

The ACD calibrations with cosmic rays determine pedestals and measure the muon peaks in the ACD tiles.  Data for pedestal calibration shall be taken with ACD zero suppression OFF.

6.2.           TKR Calibration

The TKR calibration will determine:

·         The list of bad channels (open, dead, noisy)

·         Calibration of the hit discriminator DAC;

·         The GTFE will scan the hit thresholds for a fixed charge injection DAC, noise can be extracted from these measurements; and,

·         The response of the time-over-threshold to injected charge up to saturation. The appropriate function will be used to fit the charging injection curve and extract the necessary constants that will be used for the SAS reconstruction.

The TKR muon calibrations of the TOT scale for a MIP are made at two levels: read out chip-level and strip-level. (This in turn provides the calibration of the charge injection scale, which is essential to adjust the threshold using the charge injection.) It also part of verification of bad channels with cosmic rays, measurement of trigger and detection efficiencies and collection of necessary data for the hit resolution measurement.

NOTE: Although alignment procedures produce calibration “constants,” these will be treated as a performance measure.

6.3.           CAL Calibration

The CAL electronic calibration suite establishes the calibration tables for the following features of each GCFE. These calibration tables give the correspondence between relevant DAC setting and output ADC bin or energy, as appropriate. Also calibrated is light asymmetry (the ratio of signals from the two ends of one crystal). There are two basic types of calibration: Charge Injection, Cosmic Muons.

Units of calibration tables can be converted to MeV in all gain settings. The CAL calibration determine:

·         Pedestals for all energy ranges in all gain settings. An estimate of the electronic noise can be derived from the pedestal width;

·         FEE transfer function for all energy ranges, i.e., the integral non-linearity of the analog and digital chain for each energy range;

·         Calibration of the low-energy discriminator (FLE) DAC;

·         Calibration of the high-energy discriminator (FHE) DAC;

·         Calibration of the zero-suppression threshold (LAC) DAC; and

·         Calibration of the auto-ranging discriminator (ULD) DAC.

NOTE: The electronic gain of each energy range is given by the linear term of the correspondence between injected charge and output ADC bin.

The CAL muon calibration suite is primarily the calibration of the “optical gain” of each photodiode to establish the correspondence between ADC bin and energy deposited. From this calibration the following are achieved:

·         Optimization of the time delay between trigger and peak hold to give maximal light yield for the ensemble of CDEs in a module;

·         Verification of the calibration in energy units of the FLE and FHE tables generated in the electronic calibration;

·         Fitting of the muon peak in each LE and HE photodiode in muon analysis gain setting. From the muon peak,  a calibration table (correspondence between ADC values and energy) is created; and,

·         Mapping of the light taper and light asymmetry in each CDE as a function of position.

There are two trigger types used: CAL internally triggering (“self-triggering”) on muons, and with an ancillary detector generating external triggers for the CAL Tower Module. The CAL self-triggering is simpler and requires no additional hardware, but it results in a modestly biased energy calibration. By contrast, the externally triggered muons do not create a biased calibration, and therefore are used to generate the final energy calibration of each channel. During LAT integration the tracker trigger can be used by CAL to provide unbiased calibrations. An externally triggered system shall be available as a reference system.


7.         Event Data

Monte Carlo “truth,” raw and reconstructed data are held in a Transient Data Storage (TDS). Data analysis files (Merit and SVAC) are produced  from TDS. Please see Figure 20.

Figure 20: TDS Input and Output

 

7.1.           Event Contributions

An event has several contributions: the TEM (AEM) carries the contributions from TKR and CAL (ACD) and corresponding trigger primitives while the GEM contains trigger and deadtime related information. All contributions are assembled in the Event Builder that lives inside the GASU.

7.1.1.        AEM

To be written.

7.1.2.        TEM

Each TEM receives detailed trigger primitive information for its through the cable controllers: eight GTCCs from the TKR (please refer to TKR Readout, section 3.2) and four from the CAL (please refer to CAL Readout, section 3.3). CAL and TKR trigger primitives come from each layer end. Please refer to Table 14.

Table 14: CAL and TKR Trigger Primitive Data

CAL

TKR

CAL LE and HE trigger request for:

·          Each layer

·          Each end

·          A bit to tell whether a signal was above zero suppression

3-in-a-row trigger request information for:

·          Each layer

·          Each view (X and Y)

·          Each end (GTRC0 and GTRC1)

TEM trigger primitive data is present in: TDS, digi root files and SVAC ntuples. Each cable controller can transmit trigger primitives to the GEM – the presence or absence of data is indicated by a bit in the event summary. Each TEM can contribute up to12 32-bit words – one word of 32-bits per layer.

7.1.3.        GEM

The GEM receives the aggregate trigger information from all the TEMs as well as from the ACD. All event entries are sampled at window closing. The system clock is 20 MHz, i.e., one tick is 50 ns.

The GEM event contributions are shown in Table 15.

Table 15: GEM Event Contribution

Data

Description

TKR Vector

16 bits containing TKR trigger signals - One per tower

ACD ROI Vector

 

16 bits to define Regions of Interest

Format depends on whether used

CAL Low Energy Vector

16 bits containing CAL low energy trigger signals

CAL High Energy Vector

16 bits containing CAL high energy trigger signals

ACD CNO Vector

12 bits containing CNO trigger signals

Tile List

State of all the ACD tiles

Livetime

·          1/Deadtime

·          24-bit counter (rolls over at 0.8 sec)

Prescale Count

·          Number of triggered events not passing the prescaler

·          24-bit counter (1 GHz)

Discarded Count

·          Number of triggered events passing prescaler but lost to LAT busy.

·          24-bit counter (1 GHz)

Sent Count

·          Number of triggered events read out (TAMs sent by the GEM)

·          16-bit counter  (65 K)

Trigger time

·          Free running counter incrementing at the system clock

·          Count from when it was reset to the event was declared.

·          25-bits  (rolls over at 7.6 sec)

1-PPS time:

 

·          Seconds:         

· Number of seconds since the GEM was reset

· 7-bits  (128 sec)

·          1-PPS time:

· Time in 50ns ticks of the last arrived 1-PPS signal

· 25-bits  (7.6 sec)

Delta event time

 

·          Time from event (n-1) to event n

·          16-bits  (3 ms)

7.2.           Data Analysis Files

The data files are:

LDF.FITS – binary format readable by online tools not used for data analysis

digi.root, recon.root and  mc.root – ROOT trees

Merit.root and SVAC.root. – ntuple files

A ROOT tree file stores a snapshot of the compiler internal data structures at the end of a successful compilation. It contains all the syntactic and semantic information for the compiled unit and all the units upon which it depends semantically. Trees are very efficient for storing the complex structure of the LAT event but retrieval of data from trees requires some basic knowledge of C++.

An Ntuple is like a table where X variables from data collection are the columns, and each event is a row. The storage requirement is proportional to the number of columns in one event and can become significant for large event samples. Ntuples are flat files which are easy to access with minimal knowledge of ROOT.

7.2.1.        LDF.FITS

The LDF.FITS file is a binary file wrapped with a FITS header. All event contributions are included and information is stored in electronics parameter space. For details please refer to the GEM (LAT-TD-01545) and TEM (LAT-TD-00605) manuals.

It is important to realize that for  data analysis, events that have errors and cannot be written by the online are discarded. If events are written but contents are corrupted a flag is set in the next step in the digi.root file. For details, please refer to the SAS workbook.

7.2.2.        Digi.root

The digi.root file is a ROOT tree which contains the same data from LDF.FITS but in a representation that is better suited for SAS reconstruction code (physical space instead of electronics space). For mapping between spaces see the mapping sections in the section on geometry. If the process of parsing information from LDF to digi generates “bad” events, these are not reconstructed and the flag BadEvt is set to 1 in digi.root.

7.2.3.        Recon.root

The Recon.root file is a ROOT tree file which contains reconstructed data using digi.root and calibration constants as input.  During initial phase of ground testing one may produce recon files without calibration, but in general, energy scales in recon files are usually calibrated.

7.2.4.        MC.root

The MC.root file is a ROOT tree which contains the MC true information and is only available for simulated data. The MC.root file does not contain all events from MC

7.2.5.        Merit.root

The Merit.root file is a ROOT ntuple which contains about 240 variables in five classes: ACD, TKR, CAL, MC and Run. Scripting is available through ROOT in C++. Integration & Test provides Hippodraw as an additional visualization tool for data analysis, with scripting via Python.

7.2.6.        SVAC.root

A ROOT file which contains most of the low level instrument variables (hits/layer, trigger primitives, GEM information) which are stored in arrays. Storage is less efficient than root Trees but access is as simple as from a flat file. Scripting is available through ROOT in C++. Integration & Test provides Hippodraw as an additional visualization tool for data analysis, with scripting via Python.

SVAC and Merit can be loaded into root at the same time and data display cuts can be applied in each one through the ROOT “friends” class.

7.3.           Data Processing Steps

Raw data sets (LDF.FITS), derived from the hardware, are parsed to create another representation of the data in a format that is readable by the SAS reconstruction software (digi.root). Digi.root is processed with SAS calibration software to generate the calibration constants files. These are loaded into the primary (SAS) database which provides a format-independent interface to allow the reconstruction software to retrieve constants when needed. With these constants the SAS reconstruction software produces calibrated data files (recon.root). After processing with analysis software, recon.root is used to create the analysis files.

A separate process queries the SAS database to retrieve calibration constants and store them in a SVAC database whose design is optimized for trending.

In a parallel path using Monte Carlo simulations, the LDF.FITS file is replaced by simulated input from a model that contains a description of the detector geometry and physics processes relevant to the LAT. The entire analysis chain follows the recipe described in the previous paragraphs until final MC analysis files are produced.

Results from the hardware analysis files can then be compared to Monte Carlo simulation results to validate the MC simulations. Data files and reports described above will be generated using an automated data processing facility, hereafter pipeline.

Figure 21 shows the data analysis flow.

 

Figure 21: Data Analysis Process Flow


8.         TKR Reconstruction

TKR reconstruction is an iterative process using information from both the CAL and TKR. The TKR reconstruction method adopts the following four-step procedure (please see  Figure 22 and Figure 23)

1. Form “Cluster Hits”

            Done by converting the hit strips to positions. Adjacent hit strips are merged to form a single hit.

2. Pattern Recognize individual tracks

            Done by associating cluster hits into candidate tracks. Individual track energies are assigned to aid in          track recognition.

3. “Fit” Track to obtain track parameters

            Inherently two-dimensional cluster locations are processed to determine three-dimensional position and direction. The errors are estimated then the energy calculations are used to help with track fitting.

4. “Vertex” fit tracks

            The common intersection point of fit tracks is determined, and a position and direction is     calculated.

For cosmic rays, the first hit layer determines the “vertex” location. The diagrams presented in Figure 23 illustrate how a cosmic ray event can have more than one track and even multiple vertices.

Figure 22: Four TKR Reconstruction Steps (Block Diagram)

 

 

Figure 23: Four Steps of TKR Reconstruction (Illustrated)

Iterative Recon allows parts of the TKR Reconstruction software to be called more than once per event. The overview is shown in Figure 24. In particular, existing pattern recognition tracks can be refit and the vertex algorithm re-run.

The Iterative Recon provides the CAL Recon with sufficient tracking information to get an improved energy estimate, which can be fed back to the track fit and vertexing algorithms. The process can be repeated as many times as the user likes (in principal) but the default is two passes.

Figure 24: Iterative TKR Reconstruction Algorithms (Block Diagram)

8.1.           Clustering (TrkClusterAlg)

The clustering algorithms group strips with adjacent hits to form a cluster. TkrClusterAlg takes the strip hits to calculate the center position to use in track fitting. The digi.root file (please refer to Digi.root in section 7.2.2) provides clustering the hit strip numbers, and Time over Threshold (ToT).

The clustering algorithms apply the TKR calibration data to account for hot/dead/sick strips and merges clusters with known dead strips between them. It also decides whether to add known hot strips to clusters.

The result of TkrClusterAlg is a list of clusters in TDS with associated XYZ coordinates and the value of ToT associated with these strips. This information is used in the next step by TkrFindAlg.

8.2.           Track Finding (TrkFindAlg)

The output of track finding is an ordered list of candidate tracks to be fit. TkrPatCand, contained in a TkrPatCandCol Gaudi object vector outputs:

·         Estimated track parameters for the candidate track (position, direction);

·         The energy assigned to the track;

·         Track candidate “quality” estimates, and;

·         Starting tower / layer information.

TkrPatCand contains the Gaudi object vector of TkrPatCandHits for each hit (cluster) associated with the candidate track. Any cluster associated to this hit is needed for the fit stage.

All are stored in the TDS.

TkrFindAlg associates clusters into candidate tracks. Three approaches exist within the TkrRecon package, as described in Table 16.

Table 16: TKR Reconstruction Clustering Methods

Name

Method

Pro’s

Con’s

Combo

Track by track. Combinatoric search through space points to find candidates.

Simple to understand (although details add complications)

Finding “wrong” tracks early in the process throws off the rest of the track finding by mis-associating hits. Can be quite time consuming depending upon the depth of the search.

Link and Tree

Global pattern recognition. Associate hits into a tree like structure.

Optimized to find tracks in entire event, less susceptible to miss associating hits.

Can be quite time consuming.

Neural Net

 

Global pattern recognition. Links nearby space points forming “neurons.”

Optimized to find tracks in entire event, less susceptible to miss associating hits.

Can be quite time consuming. Operates in 2D and then requires mating to get 3D track.

 

Also: “Monte Carlo” pattern recognition exists for testing fitting and vertexing.

There are two basic Combinatoric strategies for track finding: CAL based or Blind search. CAL based is used when there is enough CAL energy present use energy centroid. When there is too little CAL energy we use only Track Hits, and make a “Blind” search.

Table 17 differentiates between to the types of combinatoric track finding methods available to ComboFindTrackTool.  In either case its starting layer is always the one furthest from the CAL. It works to combine clusters in adjacent X-Y layers to form 3D space points.

Table 17: TKR Reconstruction Combinatoric Track Finding Methods

Name

When Used

Strategy

CAL Energy Present

Sufficient CAL energy, about 42 MeV.

Track fit uses the CAL centroid by first attempting to connect the hit with CAL centroid. It connects the first two hits, then projects and adds hits along the track within the search reason. The search region is set by propagating the track errors through the GLAST geometry. Please see Figure 25.

Blind search

Insufficient CAL energy.

The first hit found is tried in combinatoric order. The 2nd hit is selected in combinatoric order. The first two hits are used to project into next layer, and a 3rd Hit is searched for. If a 3rd hit is found the track is built by “finding – following.”

 

Figure 25: Combinatoric Pattern Recognition: ComboFindTrack Tool

8.3.           Track Fitting (TkrFitTrackAlg)

The next step is for the TkrReconAlg to fit the candidate tracks using the parameters of X, Y and the slopes of X and Y. It tracks the parameter error matrix (parameter errors and correlations) and measures of the quality of the track fit using the Kalman filter method.

The filter process starts at the conversion point, but we want the best estimate of the track parameters at the conversion point. This requires propagating the influence of all the subsequent hits backwards to the beginning of the track, essentially running the filter in reverse. This is called the smoother, and the linear algebra is similar:

            Residuals: r(k) = X(k) -Pm(k)

            Covariance of r(k): Cr(k) = V(k) -C(k)

            Then: X2 = r(k)TCr(k)-1r(k) for the kth step

8.4.           Vertexing (TkrVertexAlg)

A pair conversion results in 2 primary tracks,  but one track could be lost due to:

·         Low energy (track must cross three planes);

·         Tracks from pair conversion don’t separate for several layers; and,

·         Track separation due to multiple scattering.

In addition, wrong vertex associations could occur because secondary tracks may be associated with primary tracks but are not part of the g conversion process.

The vertexing algorithm attempts to associate “best” track (from track finding) with one of the other found tracks by finding “the” vertex and returning unassociated (“isolated”) tracks as single prong vertices. It determines the reconstructed position of the conversion and the reconstructed direction of the conversion. Currently two methods available, as listed in Table 18.

In the presence of charged particles only, the vertex is considered to be at the first layer hit.

Table 18: TKR Reconstruction Vertexing Tools

Tool

Method

Description

“Combo” (default)

Uses track Distance of Closest Approach (DOCA) to associate tracks.

 

1. The vertex is determined at two tracks’ Distance of Closest Approach (DOCA).

2. The first track is the “best” track from track finding/fitting algorithms.

3. It is looped through “other” tracks looking for best match:

·          Smallest DOCA

·          Weighting factors:

· Separation between the starting points of the two tracks

· Track energy

· Track quality

4. It calculate vertex quantities:

·          Vertex Position: Midpoint of DOCA vector

·          Vertex Direction: Weighted vector sum of individual track directions

Not a true HEP Vertex Fit

Kalman Filter

Kalman Filter

 

The output from the vertexing algorithms is an ordered list of vertices with the following TkrVertex objects contained in a Gaudi Object Vector:

·         The vertex track parameters (x, mx, y, my);

·         The vertex track parameter covariance matrix;

·         The vertex energy;

·         The vertex quality;

·         The first tower/layer information; and,

·         Gaudi reference vector to the tracks in the vertex.

The first vertex in the list is the “best” vertex, and the rest are mostly associated with “isolated” track.

 



10.    Monte Carlo Simulations

MC simulations are run for both simulated cosmic rays at sea level and photons generated by a Van De Graaff generator.

MC simulations on thresholds and noise are taken for data analysis purposes, and are also described here.

10.1.      Low Energy Photon Source

Simulated g photons are derived from real proton / Lithium 7   collisions according to Figure 26.

Figure 26: Simulation of VDG Gammas – Simulated Particle Source Generation

For MC simulation, there is no Li target – only the g are simulated, with an energy spectrum having the main distribution at 14.6 MeV and a 17.6 MeV line spectrum. The ratio of numbers of events at 17.6 MeV / number of events at 14.6 MeV is 2:1.

The shielding is defined as a simulated iron cylinder with radius of 26 mm and thickness of 1.25 mm (7% X0). The X position = -200 mm; the Y position = 200 mm; the Z position = 636 mm, ~ 3mm above the TKR. The energy spectrum is angular-dependent.

Note that g  photons which convert in the Fe shield generate an unwanted experimental background of charged particles.

10.2.      Cosmic Ray Source

The default scenario program name is surface_muons. It models energy / angle correlations and has a spectrum to include events below 1 GeV. It can produce a small number of unphysical, low energy events that are platform dependent.

Figure 27 shows the distribution of kinetic energy vs particle flux for surface_muons.

Figure 27: Particle Flux vs Kinetic Energy for surface_muon Source

10.3.      Thresholds and Noise

The TKR occupancy in MC is usually set at 510 -5 / strip, meaning that one should expect about 3 noisy hits per tower, on average (510 -5 /strip x 1536 strips x 36 layers per tower).

 

 


11.    Data Analysis

This section is intended to guide users in the usage of the existing data analysis variables. There is no way to provide a recipe for data analysis, but the idea is to illustrate how to use the information in the data analysis files.

11.1.      Identification of Minimum Ionizing Particles

A MIP selection can involve information from TKR, CAL and ACD.

It would be naïve to search for a single straight track, with one hit in each TKR layer, that when extrapolated to the CAL, deposits about 11 MeV in each crystal layer.

The SVAC file has hits per layer and clusters per layer for every tower while the Merit ntuple has clusters associated to tracks for all towers.

Care needs to be exercised when selecting variables such as TkrTrackLength. This variable measures an extrapolated length from the first hit layer to the grid by dividing Tkr1Z0 (Z position at first hit of track1) by Tkr1ZDir (direction cosine for track1). Thus, for a situation illustrated in Figure 28, both track lengths are equal.

Figure 28: TrkTrackLength Example of Easily Misinterpreted Data

 

11.2.      CALTowerGap

 

Note that when extrapolating a track into the CAL sometimes the track will go traverse different amounts of material even if it is a straight track. The reason is depicted in  Figure 29. One clearly sees the there is an offset between successive CAL layers, so a on-axis muon, contrary to a naive intuition, may hit every other layer.

Figure 29: A Charged Particle’s Path is Parallel to the Z Axis and only Strikes Every Other Crystal


12.    Resources

LAT-DOCS:

AEM:

LAT-TD-00639 The Anti-Coincidence Detector Electronics Module (AEM) Programming ICD Specification

GEM:

LAT-TD-01545 The GLT Electronics Module Programming ICD Specification

GENERAL:

LAT-TD-00376   Naming Convention for GLAST Tracker Construction and Tray Orientation in Tracker Tower

LAT-TD-00035   LAT Coordinate System

TEM:

LAT-TD-00605 The Tower Electronics Module (TEM) Programming ICD Specification

Timing Registers:

LAT-TD-04134-01 How to Set the LAT Timing Registers

Trigger:

LAT-SS-00286 LAT Global Trigger Specification

LAT-TD-00560 LAT Global Trigger and ACD Hit Map

LAT-TD-01545 GEM Programming ICD

URLs:

Integration and Test Peer Reviews:

http://www-glast.slac.stanford.edu/IntegrationTest/ReadinessReviews/IRR_Peer_Reviews/IRR_Peer_Reviews.htm

Instrument Analysis Group Workshops, SLAC, June 7, 8 2004:

http://www-glast.slac.stanford.edu/IntegrationTest/SVAC/Instrument_Analysis/agenda.htm

Instrument Analysis Group Friday Morning Meetings:

http://www-glast.slac.stanford.edu/IntegrationTest/SVAC/Instrument_Analysis/agenda.htm

Integration and Test SVAC/SAS Telecons:

http://www-glast.slac.stanford.edu/IntegrationTest/SVAC/meetings/Default.htm

Science Verification Analysis and Calibration (SVAC) Website:

http://www-glast.slac.stanford.edu/IntegrationTest/SVAC/default.htm