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Document # |
Date Effective |
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LAT-TD-7500 |
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Prepared by(s) |
Supersedes |
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L. Latronico |
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GLAST LAT Technical
Note |
H. Tajima R. P. Johnson |
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Subsystem/Office |
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Tracker Subsystem |
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Document Title |
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Gamma-ray Large Area Space Telescope (GLAST)
Large Area Telescope (LAT)
Tracker Subsystem
End Item Data Package
Tower 14
DOCUMENT APPROVAL
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Prepared
by: |
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L. Latronico |
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Date |
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Approved by: |
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E. Rapposelli |
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Date |
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L. Latronico |
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Date |
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N. Mazziotta TKR Subsystem Environmental Test Lead Engineer |
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Date |
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A. Troianiello |
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Date |
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Date |
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A. Brez |
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Date |
LAT Acceptance
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Dick Horn |
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Date |
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Pat Hascall |
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Date |
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Elliott Bloom |
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Date |
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Darren Marsh |
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Date |
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Other |
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Date |
CHANGE HISTORY LOG
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Revision |
Effective Date |
Description of Changes |
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01 |
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Initial Draft |
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02 |
11 Oct 2005 |
Update with SLAC test results |
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The purpose of this document is to collect all the data for the Glast LAT Tracker (TKR) Tower End Item Data Package (EIDP), in compliance with LAT-TD-04350 and PRC_Pi_QC_005. This document is compiled and reviewed within the Tracker subsystem prior to shipment of Tower 14 from INFN to SLAC. The contents of this document have been coordinated between LAT Integration, Test, and Calibration (IT&C), LAT Systems Engineering (SE), LAT Quality Assurance (QA), and the TKR subsystem.
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Item Description: |
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Identification |
Part/Drawing
Number |
Serial
Number |
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LAT-DS-00722 |
14 |
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Cable holding plate |
LAT-DS-03826 |
NA |
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LAT-DS-03949 |
NA |
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MECHANICAL SUMMARY DATA |
Mechanical Lead: E.
Rapposelli |
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ITEM: |
REMARKS: |
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Structural
Analysis reviewed and acceptable |
Available on
file at SLAC |
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Structural
Tests reviewed and acceptable |
Available on
file at SLAC |
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Open Items from tests
performed or from meetings with SLAC |
None |
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Mass (measured) |
33.030 Kg |
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Mass / Center of Mass
Report - Analysis |
Mass / CoM
report |
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Dimensions |
Complies with IDD |
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Interface flatness and
surface finish |
Complies with IDD |
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Dimension Inspection
Report |
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Final visual inspection prior
to shipping |
Tower Flow-chart on file
at INFN-Pisa (summary) |
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ELECTRICAL SUMMARY DATA |
Electrical Lead: |
Electrical Lead: |
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DESCRIPTION: |
REMARKS: |
REMARKS: |
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Power consumption (28V, 25
deg C, nominal activity) TKR + TEM/TPS |
18.6 W |
19.3 W (21.1
deg C) |
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Power consumption (AVVDA,
AVDDB, DVDD, 25 C, nominal Activity) |
10.0 W |
9.8 W (21.1 deg C) |
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Overall leakage current at
100V |
84.0 μA |
86.0 μA (21.1 deg C) |
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Part List reviewed and
acceptable |
Tower Flow-chart on file
at INFN-Pisa |
N/A |
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Pre-ship electrical Test
reviewed and acceptable |
Available on file at
INFN-Pisa |
N/A (See below for post-shipping and hand-off test results.) |
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Open Items from previous
reviews / meetings / tests |
Status of channels history(link) |
Status of channels history (link) |
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Relevant support documents |
Standard schema (xml archive) Tower Map (link) |
Standard schema (xml archive) |
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PRODUCT ASSURANCE DATA |
Quality Lead Engineer: |
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DESCRIPTION: |
REMARKS: |
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Non-conformance report
summary |
NCR summary (link) |
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Open NCRs / RFW / RFD |
NA |
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Traceability of unit
pedigree |
Tower Flow-chart on file
at INFN-Pisa |
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Photographic Record |
On file at INFN-Pisa (link) |
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Inspection records |
Tower Flow-chart on file at
INFN-Pisa |
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Storage, handling, shock
records |
On file at INFN-Pisa |
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WOA list |
Tower Flow-chart and
procedural travelers therein – available on file at INFN-Pisa |
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All operations, inspections,
and tests have been completed per procedures as indicated on WOA (signed and
dated) |
Tower Flow-chart and
procedural travelers therein – available on file at INFN-Pisa |
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All operations performed
to released and controlled procedures |
Procedures available on
file at SLAC and INFN-Pisa |
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Chronological history is
up-to-date and reflects each major action that has transpired |
Tower Flow-chart on file
at INFN-Pisa |
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Identity of manufacturers,
part numbers, and serial number are correct |
Tower Flow-chart on file
at INFN-Pisa |
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All Problem Reports,
Material Review Board Reports, and failure reports are closed and accepted as
per internal procedures |
NCR database available on file
and on web at INFN-Pisa |
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Materials and processes
used in the hardware are approved and acceptable |
Materials and processes
under configuration control at SLAC |
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