Minutes of the Tracker Technical Meeting
December 5, 2002
Action Items:
1. BJ: send MCM/tray integration cross
section drawing to Sandro.
2. Tom: add an approval column to the list of
procurements
3. Tom: contact Alcomp.
4. Tom: look into YS90 prices in the U.S.A.
5. Ossie: ship the top tray tooling.
We discussed pitch adapter issues. Teledyne found that the latest items (from
Parlex) have too wide a coverlayer.
They don't have space with tolerance for the wire-bonding areas. Sandro said that he has been discussing the
MCM interface with G&A. They came
to the conclusion that they need to glue the dam on. The dam would be a thin strip of dielectric material that gets
glued onto the region covered by Teledyne with encapsulation. We don't need the coverlayer in that case,
as the G&A encapsulant will complete the coverate of the pitch adapter.
Robert cautioned to be careful about
clearance with the tower wall. The wall
must not compress the G&A encapsulant, as it is silicone and therefore
would not necessarily protect the wire bonds from such mechanical action. BJ will email his cross-section drawing of
the region to Sandro. The dam Sandro is
talking about would be about 0.3mm tall.
The cable is 0.8mm thick. Tom
has some samples in hand.
Sandro said that Riccardo is at Plyform to
glue tungsten onto trays. He will know
results tomorrow. The Kapton tool is
ready. Final trays should be coming out
next week. Heavy converter trays will
be first.
G&A has about 70 ladders made. Sandro is experiencing delays in receiving
data from G&A. There are 2 ladders
with high current that is unexplained.
Sandro is concerned and will investigate next week. The currents are several uA. Also, the probe station scratched one ladder. That problem is being corrected to avoid
repeat occurances. 40 more ladders are
ready for electrical test on Monday.
Encapsulation progress: the 2nd trial was not as good as the first,
in appearance (see last week's minutes).
Nevertheless, current after encapsulation good. The problem was some flow outside of the
dam.
Sandro et al made a visit to Alenea space
facilities. They have a large thermal
vacuum chamber, which can accommodate more than one tower. Also two large shakers. It is an attractive idea to do all tower
qualification there.
We received a list of flight procurements
from Tom (see below). The project wants
approval by Darren before we buy flight hardware and materials. Tom will add an approval column.
Tom will call Alcomp to find out the
carbon-carbon status.
Tower wall status. Sandro is working on placing an order for materials. The YS90 fabric is expensive and he must buy
twice what is needed for the EM. The
K13D material is $2k/wall. The YS90
weave is also $2k/wall, with a lot of extra.
The bulk of the wall is K13D fabric, but the inner and outer surfaces
have a thin weave of YS90. Tom will
check on prices available to SLAC. Erik
said that in the USA the K13D is much more expensive than YS90.
Tom and the IPO will discuss schedule and
design with Hytec at SLAC today. At
issue is the schedule to get to CDR.
Ossie needed advice on the shipping for
top-tray tooling. The declared cost
will be about $10k. Sandro said to ship
it cargo-no-courrier to the Pisa airport.
INFN Pisa will do a temporary importation, so SLAC will get them back
one day. On the other hand, send glues
and such items than cannot be temporarily imported by Fed-Ex directly to the
INFN address.
|
Part |
Purchaser |
Vendor |
Del Date |
Need Quantity |
Ordered Quantity |
|
SSD’s LAT-DS-00011 |
SLAC – INFN - Japan |
Hamamatsu |
Ongoing |
10,496 |
11,400 |
|
Bias Circuits |
SLAC |
Data Circuits |
|
648 |
|
|
Thin Converters LAT-DS-00791 |
INFN |
? |
|
3996 |
4200 |
|
Thick Converters LAT-DS-00792 |
SLAC |
Kulite Div (HC Stark) |
|
1152 |
1730 |
|
4 Ply Face Sheets LAT-DS-00049, LAT-DS-00596 |
INFN |
Plyform |
|
468 |
|
|
6 Ply Face Sheets LAT-DS-00617, LAT-DS-00618 |
INFN |
Plyform |
|
144 |
|
|
Light Core |
INFN |
Plascore |
|
|
|
|
Light/Thin Core |
INFN |
Plascore |
|
|
|
|
Heavy Core |
INFN |
Plascore |
|
|
|
|
|
|
|
|
|
|
|
Std Closeouts LAT-DS-00092, LAT-DS-00093 |
SLAC |
Allcomp |
12-26-02 to |
1216 |
|
|
Top Closeouts LAT-DS-00196, LAT-DS-00197 |
SLAC |
Allcomp |
2/28/02 |
72 |
80 |
|
Bottom Closeouts LAT-DS-00800, LAT-DS-00801 |
SLAC |
Allcomp |
|
72 |
80 |
|
|
|
|
|
|
|
|
Tray Inserts |
INFN |
Plyform |
|
270 |
330 |
|
TMCM Screws |
INFN |
|
|
|
|
|
Tall TMCM’s |
SLAC |
Young Electronics |
|
4 |
5 |
|
Short TMCM’s |
SLAC |
Young Electronics |
|
41 |
65 |
|
Tall TMCM’s-Assembled |
SLAC |
Teledyne |
|
4 |
4 |
|
Short TMCM’s-Assembled |
SLAC |
Teledyne |
3/15/02 |
41 |
54 |
|
Converter Adhesive |
INFN |
Plyform |
Plyform stock |
AR |
AR |
|
SSD Adhesive |
INFN |
Nusil |
Plyform stock |
AR |
AR |
|
SSD Encapsulation |
SLAC |
Nusil |
G&A stock |
AR |
AR |
|
TMCM Adhesive |
INFN |
3M Conductive Tape |
|
AR |
AR |
|
TMCM Handling Box |
SLAC |
Azimuth |
8/1/02 |
715 |
750 |
|
Side Walls |
INFN |
Plyform |
|
72 |
80 |
|
Side Walls Screws |
SLAC |
|
|
|
|
|
Flexures & Mount Plates |
SLAC |
|
|
8/8 |
10/8 |
|
Flexure Mount Screws |
SLAC |
|
|
32 |
|
|
Thermal Gasket |
SLAC |
|
|
AR |
AR |
|
Conductive Tape-corners |
SLAC |
|
|
AR |
AR |
|
8 Flex Cables |
SLAC |
Paralex |
|
144 |
160 |
|
Lifting Fixture |
SLAC |
|
|
1 |
1 |
|
Vibration Fixture |
SLAC |
Hand Precision |
11/1/01 |
18 |
18 |
|
Tower Shipping Box |
SLAC |
|
|
18 |
20 |
|
Environmental condition tracking devices |
SLAC |
|
|
18 |
|