Minutes of the Tracker Technical Meeting
November 27, 2002
Action Items:
1. Tom: get the top tray tooling shipped to
Pisa.
2. Tom: check on the carbon-carbon
production.
3. Tom & Ossie: look into procuring all
of the flight core material.
4. Tom: start the order for the thick
tungsten.
Sandro sent a photo of a ladder with
encapsulated wire bonds, made by G&A using the Nusil encapsulant. It was made from working but marginal SSDs.
Sandro said that they had to make a
modification to the tool for installing thin tungsten. Thin walls between depressions where the
foils go degrade after a few uses.
Completed panels at Pisa were put in an oven
for a curing cycle. Plyform will start
next week with tungsten and Kapton assembly.
Electrical tests on flight ladders look good
at G&A.
MCM-tray integration discussed yesterday at
G&A during Sandro's visit. He will
send one bare tray tomorrow for them to use to develop tooling. They also discussed encapsulation of edge
bonds. It does not appear to be easy
with the low viscoscity material, as the are a lot of potential crevices for it
to disappear into.
The week of Dec 16 doesn't work for G&A
for a visit by Darren. Alternatives
will be investigated.
Tom said that all equipment will be available
by the end of the week of Dec 12 for the Pisa electronics test set, except that
an interface card is needed. Robert
asked if the one already there can be used.
Tom said that Lowell will talk to Erik
Swensen about risks that the project is assuming, so that Hytec will be clear
on that.
SLAC needs to ship out the top tray tooling
asap.
We plan to test MCMs at Teledyne Dec 9. Teledyne is estimating completion of the
assembly toward the end of the prior week.
Tom needs to check on carbon carbon
production progress.
Sandro said that Plyform does not want to
work on honeycomb machining and expansion.
Can the USA do it? Tom and Ossie
will look into this. Sandro said that
an exchange of some sort can be made to cover expenses for that.
Sandro said that he has a quote for thin W,
from Plansee. It is 0.1mm thick with a
tolerance of +-15microns. He will order
222 plates (200mm by 790mm), one for each tray.
Tom will check on getting together the order
for the thick tungsten.
A review of the Tracker ASICs is scheduled for December 6.