Minutes of the Tracker Technical Meeting
September 18, 2002
Action Items:
1.
Robert: check the wire bonder clearance at UCSC
2.
Tom: work with Sandro on procuring EM walls in K13D.
3.
Dave: submit new GTRC prototype run
4.
Erik: send Tom the spreadsheet of predicted loads on the flexure-mount
fasteners
Sandro was not present but reported the following
last week: Plyform assembled closeouts were measured at Pisa. The maximum error was 60 microns, found on
two of them. Plyform is producing
another set and will check if the error is systematic. Plyform is working at a mean production rate
of one bare tray panel per day. Sandro
estimates the end of production on October 8 for all mid trays. Plyform is still in progress to machine
tooling for kapton and tungsten bonding.
Tom has been working on the electronics test station
plan. Mike Huffer agrees on using a simple test system at Teledyne. However, the burn-in at SLAC/UCSC will
employ the full-blown test system, which will give a complete system verification
at that level. The burn-in station
systems will ship to Italy after burn-in is completed. There was some discussion of the need for a
cold spare in Italy. We concluded that
at least we need a spare TEM and cables and other specialized hardware. Spare VME crates and PCs may not be
necessary.
Ossie reported that the EM readout cables should be
delivered in early October.
The bottom closeout pieces are expected at SLAC this
week. Tom needs to check on that.
The top closeout pieces shipped a week ago to Pisa.
BJ placed an order yesterday for the top/bottom
insert bonding tool.
Bottom tray tooling manufacture was stopped pending
completion of the bottom-tray design.
The top tray assembly tool is expected the week of
7th October.
Tom mentioned that the board house for the
replacement EM PWBs does not want to install the thickened piece on the
MCMs. In that case SLAC will have to
bond on pieces before machining the radius.
Young Electronics, foreseen for the flight build, is willing to do that
bonding.
Robert reported that GTFE wafer probing is in
progress to supply Teledyne with tested chips for the working EM modules. The test station is being modified to check
more carefully the trigger output, since several chips have been seen that have
an oscillating output.
Ossie has nearly completed the jigs to mount SSD
ladders on for testing with mini-MCMs.
Robert will check that 4 mm vertical and 3/8 inch horizontal clearance
is okay for the wire bonder (it is).
Osse is talking to GMSI about machining walls. Tom said that we need to ask the Italians to
make K13D panels at Plyform for EM in addition to one for testing. Tom will send email to Sandro today. Erik said that we should also get shorter
sidewalls of the same material for the static test setup. That will require 2 extra full-size panels
for a total of 7. These are needed by
beginning of February for Hytec.
BJ sent out for a quote on a new vibration fixture,
without the cantelevered flexure mounts.
Tom has a meeting tomorrow with Martin to talk about the interface and
the flexures. There are some possible
clearance issues in the grid.
The ladder PRR was held Monday, but flight production
awaits completion of tests on the new encapsulation material. Robert updated the ladder PRR documents and
put them on the web. Tom should receive
samples of Nusil today and ship them to Italy.
He also made a second order, for enough for the first 400 ladders. Tom will hand carry that to Italy. Tom is leaving Monday September 30 and
returning Monday October 7. He sent a
proposed itinerary to Sandro. Darren
will also go, to inspect G&A.
Robert wants to know Sandro's plans on testing
polyimide and aramid boards for CTE issues.
Those boards should be arriving in Italy along with the new CC material.
Nelson should go ahead with a new GTRC submission to
correct the parity bug and improve some other features. The existing chips are fine for the EM.
GTFE testing continues. The noise meets the requirements, but a few G chips have been
found to have oscillating trigger outputs.
There is concern about understanding that failure mode.
Erik has been reviewing the tracker/LAT ICD. He is not sure if the Grid interface should
be specified as forces. Another option
is deflections. Hytec engineers are
discussing what is needed at this interface.
They are not sure yet how best to treat random vibration interaction
between grid and tracker. Tom suggested
to put the static load from grid deflection on top of random vibration. Erik will send Tom his spreadsheet of
predicted loads.