Tracker Status Report
January 30, 2004
1. Thermal Vacuum Testing (N. Mazziotta)
a. The test preparation goes on. There was a very useful meeting in Pisa with Alenia/SLAC/NASA and INFN representatives to push forward the preparation of the test.
b. The start of the test is scheduled for the 1st of March.
c. All info about the test is available on the Bari web page: this address will be the reference for future development.
2. Tracker IDD (M. Nordby)
a. This did not get signed off last week because of serious issues that needed further work on the Tracker side.
b. M. Nordby and M. Menning are working the issues.
3. SSD Procurement (A. Brez)
a. Purchasing of the last 2000 wafers is in progress.
b. 9452 wafers have been received in Italy.
c. 8800 wafers have been tested, with 46 rejected.
4. Ladder Assembly and Test (A. Brez)
a. 820 ladders have been assembled
b. 16 ladders were rejected
5. Bottom Tray Closeouts (J. Martin)
a. The second phase at COI, final machining, is still on hold pending resolution of a 115 micron discrepancy in one closeout dimension, which was found late last week.
b. We plan to close this by Feb 6th, so COI can proceed using new drawings.
6. Bottom Tray Titanium Parts and Flexures (M. Menning)
a. Responsibility for the bottom tray and titanium parts drawings has been consolidated under Martin Nordby and Mike Foss.
b. The effort for the closures for the bottom trays are expected to be complete on 6 Feb. Most of the work on these items is the model clean-up. Included in the work on the titanium parts are the corner fittings, the corner and side flexures, and all of the small details on the pre-loaded eccentric cones whether they are titanium or not.
c. There is additional review for these drawings required from Martin, but 6 Feb is still the planned completion date.
7. Bottom Tray Static Test (R. Johnson)
a. EM static tests were completed at Hytec.
b. Planning is in progress to ship the static test fixture to Pisa. The bottom tray also needs to go.
c. The fixture will have to be upgraded to the new bottom tray interface before use in flight production.
8. Bias Circuit Fabrication (J. Clinton)
a. Most of the 400 circuits have been fabricated by Parlex.
b. There is an issue with the bus traces used by Parlex for plating—they will have to be trimmed through after mounting the circuit on the tray. This may require an additional electrical test after trimming.
c. The circuits were built to a redlined version Rev-4 version. The redlines are incorporated in the Rev-5 that is out for release.
9. Bottom Tray Panel Assembly Tooling (R. Bagagli)
a. Riccardo started these drawings and needs at least 10 day to finalize them. Plyform will need about 15-20 working days to machine these tools.
b. M. Nordby and M. Menning will fly to Pisa the second week of February to review the tooling and bottom tray assembly procedures in the context of the interface piece-parts presently being designed at SLAC.
10. Honeycomb Cores (J. Tice)
a. SLAC has done a visual inspection at Plascor of all material and has approved the quality and packaging requirement of the honeycomb material.
b. The carrier has received the material and will be loading on to plane within the next couple of days.
c. Material should be at the Pisa airport early/mid next week. Will get confirmation of delivery date once material is loaded onto plane. Sandro has the Pro Forma invoice.
11. Mid Tray Panel Fabrication
a. SLAC QA and Manufacturing and B. Rodini from Swales joined INFN at Plyform to wrap up the PRR. First reports are very positive about getting all the actions wrapped up.
12. Mid Tray Panel Bakeout
a. This was discussed at the Plyform meeting, and T. Venator has an action to look into the requirements and specifications.
13. PWB Machining and Inspection (D. Rich)
a. Boards were sorted according to panels that have been coupon tested already.
b. N. Virmani is working on getting coupon evaluation speeded up, and coupons from panels already machined by Holt are being put at the start of the queue.
c. Boards are ready to go to Holt as soon as an EH&S issue is wrapped up.
14. Pitch Adapter Receiving and Inspection (D. Rich)
a. Drawings were completed for a tool to expedite the measurement process, and the tool is being machined.
15. Nano-Connector Fabrication (J. Tice)
a. Due date for the first shipment of male connectors is planned for Feb. 9, pending results from Omnetics on the bonding process (high priority).
16. ASIC Fabrication, test, and dicing (R. Johnson)
a. Several GTRC-V7 wafers were probe tested. The chips function as intended with >90% yield.
b. One wafer is being diced, so chips will be available for testing on MCMs and for inserting into the Teledyne pre-production Monday or Tuesday.
17. Polyswitch Qualification (H. Sadrozinski)
a. Nick Virmani reported that the polyswitches have been approved for the use in the LAT TKR.
18. MCM Test System (R. Johnson)
a. Work continues on finalizing the software and documentation.
19. MCM Assembly and Test (R. Johnson)
a. Preproduction continues, with both pre-encap and post-conformal-coat electrical testing in progress at Teledyne yesterday and today.
b. 10 MCMs finished burn-in and final test and were measured by CMM. 7 are shipping to Italy today.
c. We are planning the PRR for Feb 10.
20. MCM Burn-In and Acceptance Test System (R. Johnson)
a. The procedure document is out for release.
b. The UCSC half of the system will be moved to the SLAC cleanroom early next week.
21. Tray Assembly Tooling for Integration of Ladders and MCMs at G&A (A. Brez)
a. Tooling for installation of ladders on bottom trays is only starting and needs to be completed by the end of February. This activity has started.
b. Drawings are ready for mockup trays for testing MCM mounting and wire bonding.
c. Documentation of the procedures is drafted but some corrections are in work.
22. Tray Vibration (N. Mazziotta)
a. Tray panel vibration test plan and procedure: the test plan and the procedure have been put in a single document. They are ready, and we are going to submit them to Sandro.
23. Tray Thermal Cycle (N. Mazziotta and C. Cecchi)
a. We have tested the two climatic chambers. We have in Terni one of 1 m2 and one of 2 m2; everything is working.
b. The test plan and procedure are still in progress. The test levels and the number of cycles need to be discussed and defined.
c. Next week the Bari group is going to Terni in order to establish the set up of the boxes in the climatic chamber. The Bari and Pisa climatic chambers have been checked and approved and will be delivered by Angelantoni mid February.
d. We have ordered the temperature sensors, enough to test a complete tower, plus 2 calibrated sensors to be used as calibration for the others. The plan is to have a cycle only for the calibration of the sensors before and after the cycle of the trays.
e. We have also ordered some grids to be put inside the climatic chamber in order to have 20 tray at once divided in the two chambers. Thus we will beable to cycle one tower in one go.
24. Stacked Tray Test (N. Mazziotta)
a. Stacked tray test fixture: one rack is ready in Bari, other 3 will be delivered to Pisa, Rome and Perugia for mid February.
b. The assembly of the scintillators is still in progress..
c. Flex-circuit cables and micro-D jumpers are needed.
25. Stacked Tray Test Scripts (L. Latronico)
a. We are rationalizing minitower test scripts, with related documentation, in view of a full-scale tower making use of a general GUI.
b. The new software is being tested at Pisa and SLAC. Specific stacked-tray configurations need to be described, coded and tested.
26. EGSE Hardware (R. Johnson)
a. The SLAC electronics group will give a new system to the Tracker next week for testing.
27. Tower Assembly Fixtures (R. Bagagli)
a. The tool to assembly the tower is already assembled and was demonstrated in the last visit to G&A.
b. G&A is doing anodization on each single part and they will send in Pisa the tool in the next week.
c. They have received the first row drawings for the rotation tool at the end of December to buy material and schedule the machining. We are going to release these drawings in the next week.
28. Shipping Containers (J. Tice)
a. Flex cables shipping container is under development. Plan for building prototype is for end of February time frame. Have vendor set up and ready for fabrication; lead time to build is less than one week.
29. Sidewall Manufacture (A. Brez)
a. B. Rodini visited Plyform and reviewed procedures, material specifications, and coupon tests.
b. Rodini will work on prepreg specifications for procurement from COI or possibly a different vendor.
30. Flex Circuit Fabrication and Test (H. Sadrozinki)
a. Flex cable layout is on hold by the project, with CAD issues being investigated.
b. Things to be done: confirm stay clear, add resistors and correct their location. Tweak location of bend areas on every cactus arm because of parts and vias. Tweek bending area on top of C4 and C5.
c. The cable tester was successfully tried out on burn-in cables at SLAC.
31. Misc. SLAC Parts & Materials (J. Tice)
a. Order has been placed for the 120 degree fasteners for the side walls, lead time is 6-8 weeks. Will ship to INFN once received and inspected.
b. Order has been placed for Hysol EA-9394. Will ship to INFN once received and inspected.
c. 200 Ohm resistors order is being signed-off (Flex cables).
32. Fabrication Database (L. Latronico)
a. Single components incoming and testing is ok for facesheets, honeycomb, tungsten, and is under development for closeout-before-inserts, Kapton, and grounding cylinders
b. Workflow-tracking in place for closeout-inserts, tray assembly, ESPI qualification test
c. Tower test database needs to be developed
d. MCM data to be transferred from UCSC need to be agreed upon
33. Tray Service Boxes (N. Mazziotta)
a. There are 100 boxes available for mid/top trays.
b. Among these 20 can be modified properly to host bottom trays.
34. Mini-Tower Testing (H. Tajima)
a. We have been taking muon data to calibrate calibration DAC scale for each GTFE and possibly each channel.